Xi'an Institute of Optics and Precision Mechanics,CAS
A method of assembling vcsel chips on a sub mount | |
其他题名 | A method of assembling vcsel chips on a sub mount |
PRUIJMBOOM ARMAND; DUMOULIN RAIMOND LOUIS; MILLER MICHAEL | |
2019-10-24 | |
专利权人 | KONINKLIJKE PHILIPS N.V. |
公开日期 | 2019-10-24 |
授权国家 | 印度 |
专利类型 | 授权发明 |
摘要 | The present invention relates to a method of assembling VCSEL chips (1) on a sub mount (2). A de wetting layer (13) is deposited on a connecting side of the VCSEL chips (1) which is to be connected to the sub mount (2). A further de wetting layer (13) is deposited on a connecting side of the sub mount (2) which is to be connected to the VCSEL chips (1). The de wetting layers (13) are deposited with a patterned design or are patterned after depositing to define connecting areas (21) on the sub mount (2) and the VCSEL chips (1). A solder (15) is applied to the connecting areas (21) of at least one of the two connecting sides. The VCSEL chips (1) are placed on the sub mount (2) and soldered to the sub mount (2) to electrically and mechanically connect the VCSEL chips (1) and the sub mount (2). With the proposed method a high alignment accuracy of the VCSEL chips (1) on the sub mount (2) is achieved without time consuming measures. |
其他摘要 | 本发明涉及在副安装座(2)上组装VCSEL芯片(1)的方法。去湿层(13)沉积在将要连接到子底座(2)的VCSEL芯片(1)的连接侧上。在要与VCSEL芯片(1)连接的子底座(2)的连接侧上沉积另一去湿层(13)。用图案设计来沉积去湿层(13),或者在沉积之后对去湿层(13)进行图案化以在子底座(2)和VCSEL芯片(1)上限定连接区域(21)。将焊料(15)施加到两个连接侧中的至少一个的连接区域(21)。 VCSEL芯片(1)放置在子底座(2)上,并焊接到子底座(2),以将VCSEL芯片(1)和子底座(2)电气和机械连接。利用所提出的方法,可以在不耗费时间的情况下实现在亚量(2)上的VCSEL芯片(1)的高对准精度。 |
申请日期 | 2014-03-26 |
专利号 | IN323584B |
专利状态 | 未确认 |
申请号 | IN2297CHENP2014 |
公开(公告)号 | IN323584B |
IPC 分类号 | H01S5/022 | H01S5/183 | H01S5/42 |
专利代理人 | - |
代理机构 | - |
文献类型 | 专利 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/32165 |
专题 | 半导体激光器专利数据库 |
作者单位 | KONINKLIJKE PHILIPS N.V. |
推荐引用方式 GB/T 7714 | PRUIJMBOOM ARMAND,DUMOULIN RAIMOND LOUIS,MILLER MICHAEL. A method of assembling vcsel chips on a sub mount. IN323584B[P]. 2019-10-24. |
条目包含的文件 | 条目无相关文件。 |
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