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Noise Contributions in On-Chip Four-Photon States
Zhang, Yanbing1; Islam, Mehedi1; Roztocki, Piotr1; Reimer, Christian1; Sciara, Stefania1; Fischer, Bennet1; Bromberg, Yaron2; Caspani, Lucia3; Chu, Sai T.4; Little, Brent E.5; Moss, David J.6; Kues, Michael1,7; Morandotti, Roberto1,8,9
2018-08-16
Conference Name2018 Photonics North, PN 2018
Source Publication2018 Photonics North, PN 2018
Conference Date2018-06-05
Conference PlaceMontreal, QC, Canada
PublisherInstitute of Electrical and Electronics Engineers Inc.
Contribution Rank5
AbstractWe present the compact and scalable realization of four-photon time-bin entangled states using a quantum frequency comb generated from an integrated photonic chip. We show how noise affects higher-order spontaneous emissions for this state. © 2018 IEEE.
Department瞬态光学技术国家重点实验室
DOI10.1109/PN.2018.8438831
Indexed ByEI
ISBN9781538675212
Language英语
EI Accession Number20183705810248
Citation statistics
Document Type会议论文
Identifierhttp://ir.opt.ac.cn/handle/181661/30622
Collection瞬态光学技术国家重点实验室
Affiliation1.INRS-EMT, 1650 Boulevard Lionel-Boulet, Varennes; QC; J3X 1S2, Canada;
2.Department of Applied Physics, Yale University, New Haven; CT; 06520, United States;
3.Institute of Photonics, Department of Physics, University of Strathclyde, United Kingdom;
4.City University of Hong Kong, Department of Physics and Material Science, Tat Chee Avenue, Hong Kong;
5.State Key Laboratory of Transient Optics and Photonics, Chinese Academy of Science, Xi'an, China;
6.Center for Micro-Photonics Swinburne, University of Technology, Hawthorne; VIC; 3122, Australia;
7.School of Engineering, University of Glasgow, Glasgow, United Kingdom;
8.National Research University of Information Technologies, Mechanics and Optics, St. Petersburg, Russia;
9.Institute of Fundamental and Frontier Sciences, University of Electronic Science and Technology of China, Chengdu; 610054, China
Recommended Citation
GB/T 7714
Zhang, Yanbing,Islam, Mehedi,Roztocki, Piotr,et al. Noise Contributions in On-Chip Four-Photon States[C]:Institute of Electrical and Electronics Engineers Inc.,2018.
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