| Influence of temperature on “Smile” in high power diode laser bars | |
| 其他题名 | 温度对高功率半导体激光器阵列“smile”的影响 |
Wang, Shu-Na1; Zhang, Pu1 ; Xiong, Ling-Ling1; Nie, Zhi-Qiang1; Wu, Di-Hai1; Liu, Xing-Sheng1,2
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| 作者部门 | 瞬态光学技术国家重点实验室 |
| 2016-05-01 | |
| 发表期刊 | Guangzi Xuebao/Acta Photonica Sinica
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| ISSN | 10044213 |
| 卷号 | 45期号:5 |
| 产权排序 | 1 |
| 其他摘要 | By the numerical modeling and experimental test, the influence of temperature on “smile” was studied. By using the finite element method, the thermal stresses induced during bar bonding and operating process were simulated respectively. In simulations, it is assumed that the deformation of the laser bar is only caused by the thermal stress. The simulated results show that the thermal stress across the laser bar decreases with the increasing of heatsink temperature. As thus, the curve of the laser bar induced by packaging thermal stress will decrease with the increasing of the temperature. In this experiment, “smile” of five samples from the same wafer and batch was measured under different heatsink temperatures. Experimental results show that “smile” of the five samples increases or decreases as heatsink temperature increasing. The possible reason which is related with the combined action between the primitive bending shape of the bare bar and the mounting thermal stress. If the bare bar before packaging is flat or convex, “smile” of the diode laser bar will decrease as the heatsink temperature increasing. In addition, if the bare bar is concave and the laser bar is still concave after packaging, “smile” will increase with the increasing of heatsink temperature. © 2016, Science Press. All right reserved. |
| 关键词 | Diodes Heat Sinks Lasers Power Semiconductor Diodes Semiconductor Lasers Temperature Thermal Stress |
| DOI | 10.3788/gzxb20164505.0514001 |
| 收录类别 | EI |
| 语种 | 中文 |
| 引用统计 | |
| 文献类型 | 期刊论文 |
| 条目标识符 | http://ir.opt.ac.cn/handle/181661/28277 |
| 专题 | 瞬态光学研究室 |
| 作者单位 | 1.State Key Laboratory of Transient Optics and Photonics, Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, Xi'an; 710119, China 2.Focuslight Technologies Co., LTD, Xi'an; 710077, China |
| 推荐引用方式 GB/T 7714 | Wang, Shu-Na,Zhang, Pu,Xiong, Ling-Ling,等. Influence of temperature on “Smile” in high power diode laser bars[J]. Guangzi Xuebao/Acta Photonica Sinica,2016,45(5). |
| APA | Wang, Shu-Na,Zhang, Pu,Xiong, Ling-Ling,Nie, Zhi-Qiang,Wu, Di-Hai,&Liu, Xing-Sheng.(2016).Influence of temperature on “Smile” in high power diode laser bars.Guangzi Xuebao/Acta Photonica Sinica,45(5). |
| MLA | Wang, Shu-Na,et al."Influence of temperature on “Smile” in high power diode laser bars".Guangzi Xuebao/Acta Photonica Sinica 45.5(2016). |
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| Influence of tempera（568KB） | 期刊论文 | 作者接受稿 | 限制开放 | CC BY-NC-SA | 请求全文 | |
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