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Modular registration and performance evaluation of the digital twin
Chou, Xiaoquan; Li, Xiaoyan
2023
会议名称3rd International Computing Imaging Conference, CITA 2023
会议录名称Third International Computing Imaging Conference, CITA 2023
卷号12921
会议日期2023-06-01
会议地点Sydney, NSW, Australia
出版者SPIE
产权排序1
摘要

Complex optical systems are composed of multiple subsystem modules, and high-precision registration between modules is the key to ensuring the overall performance indicators of optical systems. The registration between submodules in the engineering optical system is divided into two aspects: spatial geometric coordination and optical feature registration. The relationship between spatial geometric alignment and optical feature registration is introduced, and the spatial geometric registration between subsystems is the linear relationship. The subsystem model is established using data matrix, and the subsystem data matrix and physical entities are mapped to each other to form the digital twin. The registration between subsystems with each other applies matrix changes to establish the mathematical model, and each subsystem forms a large complex engineering optical system through registration. The error affecting the registration performance of the subsystem, the relationship between the registration error and the performance of the entire optical system, and the error data transfer between the physical entity and the digital matrix model were systematically analyzed, as well as the mathematical model and the entity registration scheme were optimized and corrected. © 2023 SPIE.

关键词modular digital twin registration optical system digital matrix
作者部门装校技术研究中心
DOI10.1117/12.2691935
收录类别EI
ISBN号9781510671409
语种英语
ISSN号0277786X;1996756X
EI入藏号20234815132717
引用统计
文献类型会议论文
条目标识符http://ir.opt.ac.cn/handle/181661/97038
专题装校技术研究中心
通讯作者Chou, Xiaoquan
作者单位Xi’an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, Shaanxi, Xi’an; 710119, China
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GB/T 7714
Chou, Xiaoquan,Li, Xiaoyan. Modular registration and performance evaluation of the digital twin[C]:SPIE,2023.
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