Amplifier assembly with semiconductor optical amplifier

OPT OpenIR > 半导体激光器专利数据库

	Amplifier assembly with semiconductor optical amplifier
其他题名	Amplifier assembly with semiconductor optical amplifier
	VILLENEUVE, ALAIN; EICHENHOLZ, JASON M.; LINGVAY, LAURANCE S.
	2019-07-18
专利权人	LUMINAR TECHNOLOGIES, INC.
公开日期	2019-07-18
授权国家	美国
专利类型	发明申请
摘要	In one embodiment, a laser system includes a seed laser diode configured to produce a free-space seed-laser beam and a seed-laser focusing lens configured to focus the seed-laser beam. The laser system also includes a semiconductor optical amplifier (SOA) that includes a front facet, a back facet, and a waveguide extending from the front facet to the back facet. The SOA is configured to: receive, at the front facet, light from the focused seed-laser beam; amplify the received light as the received light propagates along the SOA waveguide from the front facet to the back facet; and emit, from the back facet, an amplified free-space beam that includes the amplified received light. The laser system further includes a mounting platform, where one or more of the seed laser diode, the seed-laser focusing lens, and the SOA are mechanically attached to the mounting platform.
其他摘要	在一个实施例中，激光系统包括配置成产生自由空间种子激光束的种子激光二极管和配置成聚焦种子激光束的种子激光聚焦透镜。激光系统还包括半导体光放大器（SOA），其包括前刻面，后刻面和从前刻面延伸到后刻面的波导。 SOA被配置为：在前端面处接收来自聚焦的种子激光束的光;当接收光沿着SOA波导从前小平面传播到背面时，放大接收到的光;从后面发射放大的自由空间光束，该光束包括放大的接收光。激光系统还包括安装平台，其中种子激光二极管，种子激光聚焦透镜和SOA中的一个或多个机械地附接到安装平台。
申请日期	2019-02-12
专利号	US20190221988A1
专利状态	申请中
申请号	US16/273736
公开（公告）号	US20190221988A1
IPC 分类号	H01S3/094 \| H01S3/00 \| G02B27/10 \| G01S7/48 \| H01S5/00 \| G02B27/09 \| H01S3/08 \| H01S3/067 \| G01S7/486 \| G01S17/10 \| H01S3/13 \| G02B26/10 \| G01S17/42 \| G01S7/481 \| G01S7/484 \| G01S7/497 \| H01S3/23 \| H01S5/40
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/89923
专题	半导体激光器专利数据库
作者单位	LUMINAR TECHNOLOGIES, INC.
推荐引用方式 GB/T 7714	VILLENEUVE, ALAIN,EICHENHOLZ, JASON M.,LINGVAY, LAURANCE S.. Amplifier assembly with semiconductor optical amplifier. US20190221988A1[P]. 2019-07-18.