Xi'an Institute of Optics and Precision Mechanics,CAS
Semiconductor laser device | |
其他题名 | Semiconductor laser device |
HIRAO MOTONAO; NAKAMURA MICHIHARU; DOI KOUNEN; TSUJI SHINJI; TAKEDA YUTAKA; MORI TAKAO | |
1981-05-06 | |
专利权人 | HITACHI LTD |
公开日期 | 1981-05-06 |
授权国家 | 日本 |
专利类型 | 发明申请 |
摘要 | PURPOSE:To prevent the failure of a laser device by a construction wherein an P-N junction is provided in the crystal portion other than the active layer of a semiconductor laser device, and the density of impurities in this junction is controlled to keep it at the prescribed value, so that an excessive current bypasses the active layer. CONSTITUTION:N-type InP12, In0.73Ga0.27As0.63P0.37 active layer 13, and P-type InP14, P-type In0.83Ga0.27As0.37P0.63 15 layers are epitaxially grown on the surface (100) of an N-type InP substrate. An SiO2 mask 21 is provided in the direction (110), and the surface is etched by a mixed liquid of bromine and methanol to form a belt layer for enclosing light on the substrate 1 Next, P-type InP19 and N-type InP20 layers are laminated successively according to the prescribed density and thickness. After removing the oxide film on the surface, a eutective Au-Sn is evaporated on it, and a eutectic Cr-Au is evaporated on the p layer 15 side to form an electrode. Then it is cleaved at a right angle to the belt layer to complete a laser device. Since P-N-P-N junction is formed by layers 14-20-19-11 on the side of the buried layer, the current and voltage characteristics have a negative resisting region, so that it prevents the device from being destroyed even when an excessive current flows. |
其他摘要 | 目的:通过在半导体激光器件的有源层以外的晶体部分中提供PN结的结构来防止激光器件的失效,并控制该结中的杂质密度以使其保持在规定值值,以便过电流绕过有源层。组成:N型InP12,In0.73Ga0.27As0.63P0.37有源层13和P型InP14,P型In0.83Ga0.27As0.37P0.63 15层外延生长在表面(100) N型InP衬底。在方向(110)上提供SiO 2掩模21,并且通过溴和甲醇的混合液体蚀刻表面以形成用于将光封闭在基板11上的带束层。接下来,P型InP19和N型InP20根据规定的密度和厚度依次层压各层。在去除表面上的氧化膜之后,在其上蒸发出共晶Au-Sn,并且在p层15侧上蒸发共晶Cr-Au以形成电极。然后将其与带束层成直角切割以完成激光装置。由于P-N-P-N结由埋层一侧的层14-20-19-11形成,因此电流和电压特性具有负阻抗区域,因此即使在过量电流流动时也能防止器件损坏。 |
申请日期 | 1979-09-28 |
专利号 | JP1981049587A |
专利状态 | 失效 |
申请号 | JP1979124118 |
公开(公告)号 | JP1981049587A |
IPC 分类号 | H01L21/208 | H01L33/16 | H01L33/28 | H01L33/30 | H01L33/40 | H01S5/00 | H01S5/227 | H01S3/18 |
专利代理人 | - |
代理机构 | - |
文献类型 | 专利 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/89777 |
专题 | 半导体激光器专利数据库 |
作者单位 | HITACHI LTD |
推荐引用方式 GB/T 7714 | HIRAO MOTONAO,NAKAMURA MICHIHARU,DOI KOUNEN,et al. Semiconductor laser device. JP1981049587A[P]. 1981-05-06. |
条目包含的文件 | ||||||
文件名称/大小 | 文献类型 | 版本类型 | 开放类型 | 使用许可 | ||
JP1983026834B2.PDF(188KB) | 专利 | 开放获取 | CC BY-NC-SA | 请求全文 |
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