Xi'an Institute of Optics and Precision Mechanics,CAS
Semiconductor light emitting device and method of manufacturing the same | |
其他题名 | Semiconductor light emitting device and method of manufacturing the same |
ONO, MASATO | |
2005-01-12 | |
专利权人 | NICHIA CORPORATION |
公开日期 | 2005-01-12 |
授权国家 | 欧洲专利局 |
专利类型 | 发明申请 |
摘要 | There are provided a light emitting device that is capable of achieving a high-electric power and high-optical power device, a method of manufacturing the same, as well as a highly reliable lighting equipment thanks to improved heat release capability. In a light emitting device with a heat-release metallic part 5 made of metal and a packaging ceramic part 1 made of ceramics bonded to the metallic part 5 via an adhesive, the adhesive is a hot melt 6 that melts with heat at a melting temperature higher than a given temperature and has flexibility when it has been hardened and formed a bond, and the ceramic part 1 has pores h at least in a given bonding surface region so that the hot melt 6 is impregnated into the pores h. |
其他摘要 | 本发明提供一种能够实现高电力和高光功率器件的发光器件,制造该发光器件的方法,以及由于改善的热释放能力而具有高可靠性的照明设备。在具有由金属制成的散热金属部件5和由陶瓷制成的包装陶瓷部件1的发光装置中,该陶瓷部件1通过粘合剂粘合到金属部件5上,该粘合剂是在熔化温度下熔化的热熔体6。高于给定温度并且当其已经硬化并形成粘合时具有柔性,并且陶瓷部件1至少在给定的粘合表面区域中具有孔h,使得热熔体6浸渍到孔h中。 |
申请日期 | 2004-07-08 |
专利号 | EP1496551A2 |
专利状态 | 授权 |
申请号 | EP2004103259 |
公开(公告)号 | EP1496551A2 |
IPC 分类号 | H01L33/48 | F21K99/00 | F21Y101/02 | H01L33/00 | H01L33/58 | H01L33/64 |
专利代理人 | - |
代理机构 | WEIHS, BRUNO |
文献类型 | 专利 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/72128 |
专题 | 半导体激光器专利数据库 |
作者单位 | NICHIA CORPORATION |
推荐引用方式 GB/T 7714 | ONO, MASATO. Semiconductor light emitting device and method of manufacturing the same. EP1496551A2[P]. 2005-01-12. |
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EP1496551A2.PDF(592KB) | 专利 | 开放获取 | CC BY-NC-SA | 请求全文 |
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