Xi'an Institute of Optics and Precision Mechanics,CAS
| Optical transmission module | |
| 其他题名 | Optical transmission module |
| GOTO MASAMI; MUTSUKAWA HIROYUKI | |
| 1992-08-14 | |
| 专利权人 | FUJITSU LTD |
| 公开日期 | 1992-08-14 |
| 授权国家 | 日本 |
| 专利类型 | 发明申请 |
| 摘要 | PURPOSE:To let both high speed properties and cooling properties to coexist by allowing a chip carrier, a package, and a wiring member to serve as a part of a combined line for a semiconductor device and forming at least a part of fixed electronic cooling device with a dielectric material. CONSTITUTION:A chip carrier 6 and an electronic cooling device 8 are installed where the chip carrier 6 is designed to hold a semiconductor laser device 2 and an optical fiber 6 while the electronic cooling device 8 is provided with the chip carrier 6. The chip carrier 6 is electrically connected with a package 10 by way of a wiring member 12. At least a part of the package 10a where the electronic cooling device 8 is fixed, is formed with a dielectric material. This construction makes it possible to let both high speed properties and cooling properties to coexist even when there exists a cooling object having a large heat release value. |
| 其他摘要 | 用途：通过允许芯片载体，封装和布线构件用作半导体器件的组合线的一部分并形成固定电子冷却装置的至少一部分，使高速特性和冷却特性共存用介电材料。组成：芯片载体6和电子冷却装置8安装在芯片载体6设计用于保持半导体激光器件2和光纤6的位置，而电子冷却装置8设有芯片载体6。芯片载体图6所示的封装10a通过布线构件12与封装10电连接。封装10a的固定电子冷却装置8的至少一部分由介电材料形成。即使存在具有大的放热值的冷却对象，这种结构也可以使高速性能和冷却性能共存。 |
| 申请日期 | 1990-12-27 |
| 专利号 | JP1992225587A |
| 专利状态 | 失效 |
| 申请号 | JP1990415062 |
| 公开（公告）号 | JP1992225587A |
| IPC 分类号 | H01L23/38 | H01L33/62 | H01L33/64 | H01S5/00 | H01L33/00 | H01S3/18 |
| 专利代理人 | - |
| 代理机构 | - |
| 文献类型 | 专利 |
| 条目标识符 | http://ir.opt.ac.cn/handle/181661/71036 |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FUJITSU LTD |
| 推荐引用方式 GB/T 7714 | GOTO MASAMI,MUTSUKAWA HIROYUKI. Optical transmission module. JP1992225587A[P]. 1992-08-14. |
| 条目包含的文件 | ||||||
| 文件名称/大小 | 文献类型 | 版本类型 | 开放类型 | 使用许可 | ||
| JP1992225587A.PDF（154KB） | 专利 | 开放获取 | CC BY-NC-SA | 请求全文 | ||
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