Semiconductor laser device

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	Semiconductor laser device
其他题名	Semiconductor laser device
	KOMURASAKI TAKESHI
	1989-07-17
专利权人	RICOH CO LTD
公开日期	1989-07-17
授权国家	日本
专利类型	发明申请
摘要	PURPOSE:To eliminate the need of adjusting an optical axis by providing a one-body fitting member having a penetrated opening, and also, forming concentrically a semiconductor laser fitting part and a collimator lens fitting part at one end side of said opening and at the other end side of said opening, respectively. CONSTITUTION:A semiconductor laser fitting part 21-2 is brought to precision working to match the outside diameter of a fitting part of a semiconductor laser 1, and positioned by pressing in the semiconductor laser In such a positioning state, an optical axis of the semiconductor lens 1 conforms with an axis center of the semiconductor laser fitting part 21-2. Also, the inside diameter part 21-4 of a collimator lens fitting part is brought to precision working concentrically with the semiconductor laser fitting part by the diameter in which a pressing-in part 40-7 of a lens holder 40 can be pressed in. Accordingly, when the lens holder 40 is screwed to a collimator lens fitting member 21-5, and screwed in with a tool by utilizing a groove 40-6, the optical axis of the semiconductor laser 1 and the optical axis of the collimator lens 41 conform with each other.
其他摘要	目的：通过提供具有穿透开口的单体装配件，以及在所述开口的一端侧和在所述开口处同心地形成半导体激光装配部件和准直透镜装配部件，以消除调节光轴的需要。所述开口的另一端分别为。组成：半导体激光装配部分21-2精确工作，以匹配半导体激光器1的装配部分的外径，并通过压入半导体激光器1定位。在这样的定位状态，光轴半导体透镜1与半导体激光器装配部分21-2的轴心一致。而且，准直透镜配合部分的内径部分21-4与半导体激光器配合部分同心地精确加工，其直径可以压入透镜支架40的压入部分40-7。因此，当透镜支架40拧到准直透镜配合构件21-5上，并利用凹槽40-6与工具拧入时，半导体激光器1的光轴和准直透镜41的光轴。彼此相符。
申请日期	1988-01-08
专利号	JP1989179112A
专利状态	失效
申请号	JP1988002160
公开（公告）号	JP1989179112A
IPC 分类号	G02B7/00 \| B41J2/47 \| G02B6/42 \| G03G15/04 \| H01S5/022
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/68960
专题	半导体激光器专利数据库
作者单位	RICOH CO LTD
推荐引用方式 GB/T 7714	KOMURASAKI TAKESHI. Semiconductor laser device. JP1989179112A[P]. 1989-07-17.

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