Mounting substrate for high-speed laser diode

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	Mounting substrate for high-speed laser diode
其他题名	Mounting substrate for high-speed laser diode
	GOTO TOMOJI; TSUJIOKA MASANORI; OTSUKA AKIRA
	1989-02-08
专利权人	SUMITOMO ELECTRIC IND LTD
公开日期	1989-02-08
授权国家	日本
专利类型	发明申请
摘要	PURPOSE:To package a high-speed laser diode with high density, and to operate it at high speed by integrally mounting the laser diode and an IC for drive onto a substrate, using a microstrip line as a signal transmission line and lowering the impedance of a power line. CONSTITUTION:IC signal conductors 5 form microstrip lines among themselves and a ground conductor 13 on the rear of a substrate, characteristic impedance is shaped in conformity with the impedance of a coaxial cable on the outside and a measuring instrument, and the reflection of a signal at the time of entering to the IC signal conductors can be removed. An IC laser connecting line 3 connecting an IC for drive and a laser diode shapes a microstrip line between the connecting line 3 and a ground plane 10 through a dielectric thin- film 8, and impedance mismatching can be eliminated. IC power lines 4 and a laser-diode power line 9 face one another, holding the ground plane 10 and the dielectric thin-film 8, characteristic impedance is shaped extremely low, and supply potential can be stabilized.
其他摘要	目的：封装高密度高速激光二极管，并通过将激光二极管和驱动IC整体安装到基板上，使用微带线作为信号传输线并降低阻抗来高速运行电力线。组成：IC信号导体5之间形成微带线和基板后部的接地导体13，特征阻抗的形状符合外部同轴电缆的阻抗和测量仪器，以及信号的反射在进入IC信号时，可以去除导体。连接用于驱动的IC和激光二极管的IC激光器连接线3通过电介质薄膜8在连接线3和接地平面10之间形成微带线，并且可以消除阻抗失配。 IC电源线4和激光二极管电源线9彼此面对，保持接地面10和电介质薄膜8，特征阻抗形状极低，并且可以稳定供电电位。
主权项	-
申请日期	1987-08-03
专利号	JP1989037892A
专利状态	失效
申请号	JP1987194042
公开（公告）号	JP1989037892A
IPC 分类号	H01S5/00 \| H01S5/042 \| H01S3/096 \| H01S3/18
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/62612
专题	半导体激光器专利数据库
作者单位	SUMITOMO ELECTRIC IND LTD
推荐引用方式 GB/T 7714	GOTO TOMOJI,TSUJIOKA MASANORI,OTSUKA AKIRA. Mounting substrate for high-speed laser diode. JP1989037892A[P]. 1989-02-08.

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