Laser processing method and a system for wafer dicing or cutting by use of a multi-segment focusing lens

OPT OpenIR > 半导体激光器专利数据库

	Laser processing method and a system for wafer dicing or cutting by use of a multi-segment focusing lens
其他题名	Laser processing method and a system for wafer dicing or cutting by use of a multi-segment focusing lens
	VANAGAS, EGIDIJUS; KIMBARAS, DZIUGAS; BAZILEVICIUS, KAROLIS ZILVINAS
	2017-12-21
专利权人	EVANA TECHNOLOGIES, UAB
公开日期	2017-12-21
授权国家	世界知识产权组织
专利类型	发明申请
摘要	The invention provides an effective laser processing method that allows to cut/scribe/cleave/dice or, generally speaking, separate, hard, brittle, and solid wafers or glass sheets, which are either bare or have microelectronic or MEMS devices formed on them. The laser processing method comprises a step of modifying a pulsed laser beam by a shaping and focusing unit, including a multi-segment lens (1 ). Said multi-segment lens creates multiple beam convergence zones, more particularly, multiple focal points, said and interference spike shape intensity distribution exceeding the optical damage threshold of the workpiece material. Said interference spike shape intensity distribution is situated in the bulk of the workpiece. During the aforementioned step a modified area is created. The laser processing method further comprises a step of creating a number of such damage structures in a predetermined breaking line or curved trajectory by relative translation of the workpiece in relation to the focal point of the laser beam.
其他摘要	本发明提供了一种有效的激光加工方法，该方法允许切割/划线/切割/切割，或者一般而言，分离硬的，脆的和实心的晶片或玻璃片，它们是裸露的或具有在其上形成的微电子或MEMS器件。激光加工方法包括通过包括多段透镜（1）的成形和聚焦单元修改脉冲激光束的步骤。所述多段透镜产生多个光束会聚区，更具体地，多个焦点，所述和干涉尖峰形状强度分布超过工件材料的光学损伤阈值。所述干涉尖峰形状强度分布位于工件的主体中。在上述步骤期间，创建修改的区域。激光加工方法还包括通过工件相对于激光束的焦点的相对平移在预定的断裂线或弯曲轨迹中产生多个这种损伤结构的步骤。
主权项	A laser processing method for substrate cleaving or dicing, comprising at steps of: providing a pulsed laser beam, focussing the laser beam by a focussing element, irradiating a workpiece with the focussed pulsed laser beam, forming a sequence of damage zones to produce a cleaving plane, wherein the workpiece material is transparent to the laser radiation and features a band gap energy exceeding the photon energy of the laser, c h a r a c t e r i z e d in that the step of focusing the laser beam involves use of a multi-segment lens, wherein at least one surface of the lens comprises segments, having different radius of curvature and each surface segment has a different focal length, wherein said different focal lengths of the segments are used to generate multiple spatially separated focal points, which are converting into an interference 'spike'-shaped focal intensity distribution..
申请日期	2016-06-14
专利号	WO2017216603A1
专利状态	未确认
申请号	PCT/IB2016/053486
公开（公告）号	WO2017216603A1
IPC 分类号	B23K26/00 \| B23K26/06 \| B23K26/073 \| B23K26/08 \| B23K26/402 \| B23K26/53 \| B23K26/0622 \| H01S5/02 \| B23K101/40 \| B23K103/00
专利代理人	PABREZA, EVALDAS
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/62151
专题	半导体激光器专利数据库
作者单位	EVANA TECHNOLOGIES, UAB
推荐引用方式 GB/T 7714	VANAGAS, EGIDIJUS,KIMBARAS, DZIUGAS,BAZILEVICIUS, KAROLIS ZILVINAS. Laser processing method and a system for wafer dicing or cutting by use of a multi-segment focusing lens. WO2017216603A1[P]. 2017-12-21.