Assembly of 2-dimensional matrix of optical transmitter or receiver based on wet etched silicon interposer

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	Assembly of 2-dimensional matrix of optical transmitter or receiver based on wet etched silicon interposer
其他题名	Assembly of 2-dimensional matrix of optical transmitter or receiver based on wet etched silicon interposer
	LI, CHENHUI; RAZ, ODED; STABILE, RIPALTA
	2019-03-14
专利权人	TECHNISCHE UNIVERSITEIT EINDHOVEN
公开日期	2019-03-14
授权国家	世界知识产权组织
专利类型	发明申请
摘要	An optical interconnect includes CMOS drivers/receivers, vertical cavity surface emitting lasers (VCSEL) or photo detectors (PD), a silicon interposer having a electrical interface connected to a pattern of wet etched square-box shape optical through silicon vias (OTSV), the CMOS drivers/receivers are connected to the electrical interface, the VCSEL/PDs are connected to the end of the electrical interface, each input/output signal of the VCSEL/PDs are aligned with the pattern of OTSVs, an optical interface (01) connected to a second side of the interposer, the optical interface is aligned with the OTSVs, the optical interface planar surface is on the silicon interposer second side and a pattern lenses opposite the planar surface and match the OTSVs, and a lensed ferrule having a pattern of lenses arranged to match the pattern of optical interface lenses, the ferrule connects with optical fiber arrays to directly connect to all the drivers or receivers.
其他摘要	光学互连包括CMOS驱动器/接收器，垂直腔表面发射激光器（VCSEL）或光电检测器（PD），硅中介层，其具有连接到湿蚀刻方盒形光学硅通孔（OTSV）图案的电接口， CMOS驱动器/接收器连接到电气接口，VCSEL / PD连接到电气接口的末端，VCSEL / PD的每个输入/输出信号与OTSV的模式对齐，光学接口（01）连接到插入器的第二侧，光学界面与OTSV对准，光学界面平面表面位于硅中介层第二侧，图案透镜与平面表面相对并与OTSV匹配，以及具有图案的透镜套圈透镜布置成与光学接口透镜的图案匹配，套管与光纤阵列连接以直接连接到所有驱动器或接收器。
主权项	1) An optical interconnect, comprising: a) a plurality of CMOS drivers or a plurality of CMOS receivers; b) a plurality of vertical cavity surface emitting lasers (VCSEL) dies or a plurality of photo detectors (PD) dies; c) a silicon interposer, wherein a first side of said silicon interposer comprises an electrical interface connected to a pattern of wet etched optical through silicon vias (OTSV), wherein said plurality of CMOS drivers or said plurality of said CMOS receivers are connected to a first end of said electrical interface, wherein said plurality of VCSEL dies or said plurality of PDs are connected to a second end of said electrical interface, wherein each input/output signal of said plurality of VCSEL dies or said plurality of PDs are aligned with said pattern of OTSVs; d) an optical interface (01) connected to a second side of said silicon interposer, wherein said 01 is aligned with said pattern of wet etched OTSVs, wherein said 01 comprises a planar surface on said silicon interposer second side and a pattern of optical interface lenses opposite said planar surface, wherein said pattern of 01 lenses matches said pattern of wet etched OTSVs; and e) a lensed ferrule having a first side and a second side, wherein said lensed ferrule first side comprising a pattern of ferrule lenses arranged to match said pattern of 01 lenses, wherein said lensed ferrule second side connects with optical fiber arrays, wherein said optical fiber arrays are directly connect to all said plurality of CMOS drivers or said plurality of CMOS receivers.
申请日期	2018-09-07
专利号	WO2019048653A1
专利状态	未确认
申请号	PCT/EP2018/074234
公开（公告）号	WO2019048653A1
IPC 分类号	G02B6/42 \| G02B6/43 \| G02B6/32 \| G02B6/38
专利代理人	FRKELLY
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/55077
专题	半导体激光器专利数据库
作者单位	TECHNISCHE UNIVERSITEIT EINDHOVEN
推荐引用方式 GB/T 7714	LI, CHENHUI,RAZ, ODED,STABILE, RIPALTA. Assembly of 2-dimensional matrix of optical transmitter or receiver based on wet etched silicon interposer. WO2019048653A1[P]. 2019-03-14.