Optical semiconductor apparatus and method of manufacturing optical semiconductor apparatus

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	Optical semiconductor apparatus and method of manufacturing optical semiconductor apparatus
其他题名	Optical semiconductor apparatus and method of manufacturing optical semiconductor apparatus
	ICHINOKURA, HIROYASU; NIIZEKI, SHOICHI
	2019-06-20
专利权人	NIKKISO CO., LTD.
公开日期	2019-06-20
授权国家	美国
专利类型	发明申请
摘要	A light emitting apparatus includes: a package substrate that includes a recess that opens on a top surface of the package substrate; a light emitting device housed in the recess; a window member provided to cover an opening of the recess; and a metal bonding part that seals a space between the package substrate and the window member. The package substrate includes a packaging surface on which the light emitting device is mounted and a metal electrode is provided, an isolation surface provided in a shape of a frame on an outer side of the packaging surface, and a light reflection surface sloping from the isolation surface toward the top surface, and a metal layer is provided on the light reflection surface with a clearance from the isolation surface.
其他摘要	一种发光装置，包括：封装基板，包括在封装基板的顶表面上开口的凹槽;发光装置容纳在凹槽中;提供窗口构件以覆盖凹槽的开口;金属键合部分密封封装基板和窗口构件之间的空间。封装基板包括：封装表面，其上安装有发光器件并设置有金属电极;隔离表面，其设置在封装表面的外侧上的框架形状中;以及光反射表面，其从隔离处倾斜朝向顶表面的表面，并且在光反射表面上提供金属层，其具有与隔离表面的间隙。
主权项	An optical semiconductor apparatus comprising: a package substrate that includes a recess that opens on a top surface of the package substrate; an optical semiconductor device housed in the recess; a window member provided to cover an opening of the recess; and a metal bonding part that seals a space between the package substrate and the window member, wherein the package substrate includes a packaging surface on which the optical semiconductor device is mounted and a metal electrode is provided, an isolation surface provided in a shape of a frame on an outer side of the packaging surface, and a light reflection surface sloping from the isolation surface toward the top surface, and a metal layer is provided on the light reflection surface with a clearance from the isolation surface.
申请日期	2019-02-25
专利号	US20190189870A1
专利状态	申请中
申请号	US16/284266
公开（公告）号	US20190189870A1
IPC 分类号	H01L33/56 \| H01L33/40 \| H01L33/60
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54948
专题	半导体激光器专利数据库
作者单位	NIKKISO CO., LTD.
推荐引用方式 GB/T 7714	ICHINOKURA, HIROYASU,NIIZEKI, SHOICHI. Optical semiconductor apparatus and method of manufacturing optical semiconductor apparatus. US20190189870A1[P]. 2019-06-20.