Packaged light emitting devices including electrode isolation structures and methods of forming packaged light emitting devices including the same

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	Packaged light emitting devices including electrode isolation structures and methods of forming packaged light emitting devices including the same
其他题名	Packaged light emitting devices including electrode isolation structures and methods of forming packaged light emitting devices including the same
	KANG, CHI-GOO; KIM, SUN-WOO; SONG, JONG-SUP; SONG, HO-YOUNG
	2018-12-20
专利权人	SAMSUNG ELECTRONICS CO., LTD.
公开日期	2018-12-20
授权国家	美国
专利类型	发明申请
摘要	A packaged light emitting device can include a mounting substrate including first and second electrode portions that are separated by a recess defined by a first side surface of the first electrode portion and a second side surface of the second electrode portion that is opposite the first side surface. An insulation support member can partially fill a lower portion of the recess to partially cover the first side surface and partially cover the second side surface. A light emitting device can be coupled to the first and second electrode portions of the mounting substrate and a sealing member can be on the mounting substrate covering the light emitting device.
其他摘要	封装的发光装置可包括安装基板，该安装基板包括由第一电极部分的第一侧表面限定的凹部分隔的第一和第二电极部分以及与第一侧表面相对的第二电极部分的第二侧表面。绝缘支撑构件可以部分地填充凹部的下部以部分地覆盖第一侧表面并且部分地覆盖第二侧表面。发光器件可以耦合到安装基板的第一和第二电极部分，并且密封构件可以在覆盖发光器件的安装基板上。
主权项	A packaged light emitting device, comprising: a mounting substrate including first and second electrode portions separated by a recess defined by a first side surface of the first electrode portion and a second side surface of the second electrode portion that is opposite the first side surface, the recess extending from the first side surface to the second side surface; an insulation support member partially filling a lower portion of the recess to partially cover the first side surface and partially cover the second side surface; a light emitting device coupled to the first and second electrode portions of the mounting substrate; and a sealing member on the mounting substrate covering the light emitting device.
申请日期	2017-12-14
专利号	US20180366615A1
专利状态	申请中
申请号	US15/841937
公开（公告）号	US20180366615A1
IPC 分类号	H01L33/44 \| H01L33/48 \| H01L33/38 \| H01L23/00
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54838
专题	半导体激光器专利数据库
作者单位	SAMSUNG ELECTRONICS CO., LTD.
推荐引用方式 GB/T 7714	KANG, CHI-GOO,KIM, SUN-WOO,SONG, JONG-SUP,et al. Packaged light emitting devices including electrode isolation structures and methods of forming packaged light emitting devices including the same. US20180366615A1[P]. 2018-12-20.