Microfabrication techniques and devices for thermal management of electronic devices

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	Microfabrication techniques and devices for thermal management of electronic devices
其他题名	Microfabrication techniques and devices for thermal management of electronic devices
	GHONEIM, MOHAMED TAREK; HUSSAIN, MUHAMMAD MUSTAFA
	2019-08-08
专利权人	KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY
公开日期	2019-08-08
授权国家	美国
专利类型	发明申请
摘要	A method of fabricating a thermal management device. The method includes depositing a seed layer, using a seed layer depositing technique, on a side of a support base; growing a heat sink base layer on a side of the seed layer; depositing a hard mask on a side of the support base directly opposite that containing the seed and heat sink base layers; patterning the hard mask with a photoresist mask; etching the patterned hard mask with an etching technique, wherein the etching creates trenches in the underlying support base, exposing the seed layer; removing the hard mask with a hard mask removal technique; depositing a layer of photoresist on the heat sink base layer; growing heat sinks using a heat sink growth technique on the exposed seed layer; removing the photoresist layer with a photoresist layer removal technique; and removing the support base with a support base removal technique.
其他摘要	一种制造热管理装置的方法。该方法包括使用种子层沉积技术在支撑基底的一侧上沉积种子层;在种子层的一侧生长散热器基层;在支撑基座的一侧上沉积硬掩模，该硬掩模与包含种子和散热器基层的那一侧直接相对;用光刻胶掩模图案化硬掩模;用蚀刻技术蚀刻图案化的硬掩模，其中蚀刻在下面的支撑基底中形成沟槽，暴露种子层;用硬掩模去除技术去除硬掩模;在散热器基层上沉积一层光刻胶;在暴露的种子层上使用散热器生长技术生长散热器;用光刻胶层去除技术去除光刻胶层;并用支撑基座移除技术移除支撑基座。
主权项	1) A method of fabricating a thermal management device, comprising: depositing a seed layer, using a seed layer depositing technique, on a side of a support base; growing a heat sink base layer on a side of the seed layer opposite the support base, using a heat sink base layer growth technique; depositing a hard mask on a side of the support base directly opposite that containing the seed and heat sink base layers, using one or more hard mask depositing techniques; patterning the hard mask with a photoresist mask and one or more patterning techniques; etching the patterned hard mask with an etching technique, wherein the etching creates trenches in the underlying support base, exposing the seed layer; removing the hard mask with a hard mask removal technique; depositing a layer of photoresist on the heat sink base layer on a side of the heat sink base layer opposite the seed layer; growing heat sinks using a heat sink growth technique on the exposed seed layer opposite the heat sink base layer; removing the photoresist layer with a photoresist layer removal technique; and removing the support base with a support base removal technique.
申请日期	2017-10-04
专利号	US20190244832A1
专利状态	申请中
申请号	US16/340487
公开（公告）号	US20190244832A1
IPC 分类号	H01L21/48 \| H01L23/373 \| H01L23/367 \| F28F21/08
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54824
专题	半导体激光器专利数据库
作者单位	KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY
推荐引用方式 GB/T 7714	GHONEIM, MOHAMED TAREK,HUSSAIN, MUHAMMAD MUSTAFA. Microfabrication techniques and devices for thermal management of electronic devices. US20190244832A1[P]. 2019-08-08.