Multi-channel optical subassembly structure and method of packaging the structure

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	Multi-channel optical subassembly structure and method of packaging the structure
其他题名	Multi-channel optical subassembly structure and method of packaging the structure
	KIM, JEONG EUN; KANG, HYUN SEO; KIM, KEO SIK; KIM, SUNG CHANG; KIM, YOUNG SUN; RYU, JI HYOUNG; PARK, HYOUNG JUN; SON, DONG HOON; YEO, CHAN IL; HEO, YOUNG SOON
	2018-04-12
专利权人	ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
公开日期	2018-04-12
授权国家	美国
专利类型	发明申请
摘要	Provided are a multi-channel optical subassembly structure allowing an optical unit including a light source photodetector chip to be fixed through an alignment jig after active alignment is performed on an individual or single light source photodetector chip by using the alignment jig capable of electrical coupling and one electrode pad and the other electrode pad of a thermoelectric element, which are wire-bonded, capable of performing active alignment for each light source photodetector chip, that is, for each channel, capable of replacing the optical unit and the alignment jig when a problem occurs in some or all channels, capable of improving optical coupling efficiency for each channel, and capable of addressing a time-consuming and economically expensive work in which an optical subassembly is discarded when some channels fail, and a method of packaging the structure.
其他摘要	本发明提供一种多通道光学组件结构，其通过使用能够电耦合的对准夹具在单个或单个光源光电探测器芯片上执行主动对准之后，允许包括光源光电探测器芯片的光学单元通过对准夹具被固定，并且热电元件的一个电极焊盘和另一个电极焊盘被引线接合，能够为每个光源光电探测器芯片即对于每个通道执行主动对准，能够替换光学单元和对准夹具，问题出现在一些或所有通道中，能够改善每个通道的光耦合效率，并且能够解决在某些通道故障时丢弃光学子组件的耗时且经济的昂贵工作，以及封装该结构的方法。
主权项	A multi-channel optical subassembly structure based on a transistor outline (TO) metal-can package, the multi-channel optical subassembly structure comprising: a module assembly mounted on a module housing of the multi-channel optical subassembly structure and having a plurality of lead pins arranged on a TO-stem; a thermoelectric element arranged on an upper surface of the TO-stem with respect to a position between the lead pins and having one electrode pad and the other electrode pad formed on an upper surface thereof; a plurality of submounts having a plurality of light source photodetector chips which are multi-channel light sources and photocouplers of the multi-channel optical subassembly structure each mounted by an upper electrode pad thereof, respectively, and arranged on the upper surface of the thermoelectric element so as not to be in contact with the one electrode pad and the other electrode pad; and an alignment jig configured to electrically connect the upper electrode pad of each of the submounts to the one electrode pad or the other electrode pad of the thermoelectric element so that fine alignment is performed while power is applied to the light source photodetector chip.
申请日期	2017-04-28
专利号	US20180100978A1
专利状态	授权
申请号	US15/581852
公开（公告）号	US20180100978A1
IPC 分类号	G02B6/42 \| G02B6/32
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54784
专题	半导体激光器专利数据库
作者单位	ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
推荐引用方式 GB/T 7714	KIM, JEONG EUN,KANG, HYUN SEO,KIM, KEO SIK,et al. Multi-channel optical subassembly structure and method of packaging the structure. US20180100978A1[P]. 2018-04-12.