LED metal pad configuration for optimized thermal resistance, solder reliability, and smt processing yields

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	LED metal pad configuration for optimized thermal resistance, solder reliability, and smt processing yields
其他题名	LED metal pad configuration for optimized thermal resistance, solder reliability, and smt processing yields
	MEHNERT, ALEX
	2017-06-08
专利权人	KONINKLIJKE PHILIPS N.V.
公开日期	2017-06-08
授权国家	世界知识产权组织
专利类型	发明申请
摘要	Cathode and anode electrodes are located on the bottom surface of an LED submount along a center line of the bottom surface. Two thermal pads are located on either side of the electrodes along opposite sides of the bottom surface. This configuration results in less stress on solder bonding the electrodes to a circuit board. Further, since the heat conducted by the two thermal pads is not choked by the electrodes, the heat spreads more uniformly into the circuit board. Further, since the metal design is symmetrical in that the outer thermal pads are identical, the molten solder will have the same shape over both thermal pads, causing the LED die and submount to be not tilted with respect to the surface of the circuit board. Other configurations are described that also improve the thermal and electrical characteristics of the LED die.
其他摘要	阴极和阳极电极沿着底表面的中心线位于LED基座的底表面上。两个热垫沿着底表面的相对侧位于电极的两侧。这种配置导致将电极焊接到电路板上的应力较小。此外，由于两个导热垫传导的热量不会被电极阻塞，因此热量更均匀地扩散到电路板中。此外，由于金属设计是对称的，因为外部热垫是相同的，熔化的焊料将在两个热垫上具有相同的形状，使得LED管芯和子安装座不会相对于电路板的表面倾斜。描述了其他配置，其还改善了LED管芯的热和电特性。
主权项	A semiconductor diode module comprising light emitting semiconductor layers (12) having at least a p-type layer and an n-type layer, wherein light exits through a first surface of the light emitting layers, and a second surface of the module having a metal pattern for connection to metal pads (66, 68, 70) on a substrate (64), the metal pattern comprising: a cathode electrode (50) electrically connected to the n-type layer; an anode electrode (52) electrically connected to the p-type layer; and two thermal pads (54, 56), electrically isolated from the cathode electrode and anode electrode, the two thermal pads being located along opposite sides of the second surface of the module and having substantially identical shapes.
申请日期	2016-11-23
专利号	WO2017095712A1
专利状态	未确认
申请号	PCT/US2016/063673
公开（公告）号	WO2017095712A1
IPC 分类号	H01L33/64 \| H01L23/34 \| H01L23/36 \| H01L23/433
专利代理人	OGONOWSKY, BRIAN D.
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54745
专题	半导体激光器专利数据库
作者单位	KONINKLIJKE PHILIPS N.V.
推荐引用方式 GB/T 7714	MEHNERT, ALEX. LED metal pad configuration for optimized thermal resistance, solder reliability, and smt processing yields. WO2017095712A1[P]. 2017-06-08.