Light-emission module having cooler and production method for light-emission module having cooler

OPT OpenIR > 半导体激光器专利数据库

	Light-emission module having cooler and production method for light-emission module having cooler
其他题名	Light-emission module having cooler and production method for light-emission module having cooler
	NAGASE TOSHIYUKI; KOMASAKI MASAHITO; IWAZAKI WATARU
	2018-08-01
专利权人	MITSUBISHI MATERIALS CORPORATION
公开日期	2018-08-01
授权国家	欧洲专利局
专利类型	发明申请
摘要	A light-emitting module with a cooler of the present invention includes a circuit layer which is formed on one surface side of an insulating layer and in which a light-emitting element is mounted, and a metal layer and a cooler which are laminated in order on the other surface side of the insulating layer. The circuit layer is formed of Cu, Al, or an alloy thereof and has a thickness of 0.1 mm or less. The metal layer and the cooler are formed of Al or an Al alloy. The metal layer and the cooler are directly bonded to each other. The ratio of the area of the light-emitting element to the area of the one surface of the insulating layer is within a range from 1:20 to 1:400.
其他摘要	具有本发明的冷却器的发光模块包括：电路层，其形成在绝缘层的一个表面侧上并且其中安装有发光元件;以及金属层和冷却器，其按顺序层叠在绝缘层的另一表面侧上。电路层由Cu，Al或其合金形成，并且具有0.1mm或更小的厚度。金属层和冷却器由Al或Al合金形成。金属层和冷却器直接相互粘合。发光元件的面积与绝缘层的一个表面的面积之比在1:20至1：400的范围内。
主权项	A light-emitting module with a cooler, comprising: a circuit layer which is formed on one surface side of an insulating layer and in which a light-emitting element is mounted; and a metal layer and a cooler which are laminated in order on the other surface side of the insulating layer, wherein the circuit layer is formed of any one selected from the group consisting of copper, a copper alloy, aluminum, and an aluminum alloy and has a thickness of 0.1 mm or less, the metal layer and the cooler are formed of aluminum or an aluminum alloy, a ratio of an area of the light-emitting element to an area of the one surface of the insulating layer is within a range from 1:20 to 1:400, and the metal layer and the cooler are directly bonded to each other.
申请日期	2016-09-20
专利号	EP3355372A1
专利状态	申请中
申请号	EP2016848582
公开（公告）号	EP3355372A1
IPC 分类号	H01L33/64 \| B23K1/00 \| B23K35/30 \| C22C5/02 \| H01L23/36 \| H01L23/40 \| B23K101/42 \| B23K103/10 \| B23K103/12
专利代理人	-
代理机构	HOFFMANN EITLE
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54731
专题	半导体激光器专利数据库
作者单位	MITSUBISHI MATERIALS CORPORATION
推荐引用方式 GB/T 7714	NAGASE TOSHIYUKI,KOMASAKI MASAHITO,IWAZAKI WATARU. Light-emission module having cooler and production method for light-emission module having cooler. EP3355372A1[P]. 2018-08-01.