Light-emitting module substrate, light-emitting module, substrate for light-emitting module having cooler, and production method for light-emitting module substrate

OPT OpenIR > 半导体激光器专利数据库

	Light-emitting module substrate, light-emitting module, substrate for light-emitting module having cooler, and production method for light-emitting module substrate
其他题名	Light-emitting module substrate, light-emitting module, substrate for light-emitting module having cooler, and production method for light-emitting module substrate
	NAGASE TOSHIYUKI; KOMASAKI MASAHITO; IWAZAKI WATARU
	2018-08-01
专利权人	MITSUBISHI MATERIALS CORPORATION
公开日期	2018-08-01
授权国家	欧洲专利局
专利类型	发明申请
摘要	A light-emitting module substrate of the present invention includes a circuit layer which is formed on one surface of an insulating layer and in which a light-emitting element is mounted, and a metal layer formed of Al or an Al alloy and a heat sink which are laminated in order on the other surface side of the insulating layer. In the heat sink, Cu is present on at least a bonding surface with respect to the metal layer. The metal layer and the heat sink are subjected to solid-phase diffusion bonding on the bonding surface. The thickness of the circuit layer is 0.1 mm or less.
其他摘要	本发明的发光模块基板包括形成在绝缘层的一个表面上并且其中安装有发光元件的电路层，以及由Al或Al合金和散热器形成的金属层。它们依次层叠在绝缘层的另一表面侧上。在散热器中，Cu至少存在于相对于金属层的接合表面上。金属层和散热器在粘合表面上进行固相扩散粘合。电路层的厚度为0.1mm或更小。
主权项	A light-emitting module substrate comprising: a circuit layer which is formed on one surface of an insulating layer and in which a light-emitting element is mounted; and a metal layer formed of aluminum or an aluminum alloy and a heat sink which are laminated in order on the other surface side of the insulating layer, wherein a copper layer formed of copper or a copper alloy is provided on at least a bonding surface of the heat sink with respect to the metal layer, and the metal layer and the heat sink are subjected to solid-phase diffusion bonding on the bonding surface, and a thickness of the circuit layer is 0.1 mm or less.
申请日期	2016-09-20
专利号	EP3355370A1
专利状态	申请中
申请号	EP2016848586
公开（公告）号	EP3355370A1
IPC 分类号	H01L33/62 \| B23K1/00 \| B23K20/00 \| B23K35/30 \| C22C5/02 \| H01L23/12 \| H01L23/13 \| H01L23/36 \| H01L23/40 \| H01L33/64 \| B23K101/42 \| B23K103/10 \| B23K103/12 \| B23K103/18
专利代理人	-
代理机构	HOFFMANN EITLE
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54730
专题	半导体激光器专利数据库
作者单位	MITSUBISHI MATERIALS CORPORATION
推荐引用方式 GB/T 7714	NAGASE TOSHIYUKI,KOMASAKI MASAHITO,IWAZAKI WATARU. Light-emitting module substrate, light-emitting module, substrate for light-emitting module having cooler, and production method for light-emitting module substrate. EP3355370A1[P]. 2018-08-01.