Light-emitting device package

OPT OpenIR > 半导体激光器专利数据库

	Light-emitting device package
其他题名	Light-emitting device package
	MOON, KEAL DOO; OH, SUNG JOO
	2019-05-23
专利权人	LG INNOTEK CO., LTD.
公开日期	2019-05-23
授权国家	美国
专利类型	发明申请
摘要	An embodiment provides a light emitting device package comprising: a package body; a first lead frame and a second lead frame, of which at least a part of each is inserted into the package body; and a light emitting device electrically flip bonded to the first lead frame and to the second lead frame, wherein the package body forms an electrode separation line between the first lead frame and the second lead frame, and the electrode separation line has at least two curved portions.
其他摘要	实施例提供一种发光器件封装，包括：封装体;第一引线框架和第二引线框架，其中每个的至少一部分插入到封装体中;发光装置，电气翻接到第一引线框架和第二引线框架，其中封装体在第一引线框架和第二引线框架之间形成电极分离线，电极分离线具有至少两个弯曲的部分。
主权项	A light-emitting device package comprising: a package body including a cavity; an insulation layer disposed on a surface of the package body; a first lead frame and a second lead frame each having at least a portion inserted into the package body; and a light-emitting device electrically flip-bonded to the first lead frame and the second lead frame, wherein the package body forms an electrode separation line between the first lead frame and the second lead frame, and the electrode separation line has at least two bent portions, wherein the electrode separation line includes a first portion, a second portion disposed at a predetermined angle relative to the first portion, and a third portion disposed at a predetermined angle relative to the second portion, wherein the first portion and the third portion are disposed so as to be symmetrical to each other with respect to a center area of the second portion, and wherein portions of the first portion and the third portion are disposed at an upper region and a lower region of the bottom surface of the cavity, respectively.
申请日期	2015-11-04
专利号	US20190157531A1
专利状态	授权
申请号	US15/527589
公开（公告）号	US20190157531A1
IPC 分类号	H01L33/62 \| H01L27/15 \| H01L23/00 \| H01L33/54
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54639
专题	半导体激光器专利数据库
作者单位	LG INNOTEK CO., LTD.
推荐引用方式 GB/T 7714	MOON, KEAL DOO,OH, SUNG JOO. Light-emitting device package. US20190157531A1[P]. 2019-05-23.