Photonic integration by FLIP-chip bonding and spot-size conversion

OPT OpenIR > 半导体激光器专利数据库

	Photonic integration by FLIP-chip bonding and spot-size conversion
其他题名	Photonic integration by FLIP-chip bonding and spot-size conversion
	KLAMKIN, JONATHAN; RISTIC, SASA
	2016-05-06
专利权人	KLAMKIN, JONATHAN
公开日期	2016-05-06
授权国家	世界知识产权组织
专利类型	发明申请
摘要	Two or more monolithic or heterogeneously integrated substrates are attached to each other and optically edge-coupled using spot-size converters. Spot-size converters are placed between planar optical waveguides and cleaved or etched facets in each substrate. The facets are provide optical edge coupling and the spot-size converters are used to adjust at least the size, shape, and divergence of the optical beams entering or exiting the optical waveguides as to improve the optical coupling between the substrates. In addition to spot-size converters, filtering and other light adjusting elements may be placed between the substrates. Integrated lasers, semiconductor optical amplifiers, and photonic integrated circuits can be provided with complementary metal-oxide semiconductor (CMOS)-compatible silicon (Si) photonic substrates, which can also contain integrated electronics.
其他摘要	两个或更多个单片或非均匀集成的基板彼此连接并使用光点尺寸转换器进行光学边缘耦合。点尺寸转换器放置在平面光波导和每个基板中的解理或蚀刻小平面之间。小平面提供光学边缘耦合，并且光斑尺寸转换器用于至少调整进入或离开光学波导的光束的尺寸，形状和发散，以改善基板之间的光学耦合。除了光斑尺寸转换器之外，滤光器和其他光调节元件可以放置在基板之间。集成激光器，半导体光放大器和光子集成电路可以提供有互补金属氧化物半导体（CMOS）兼容的硅（Si）光子基板，其也可以包含集成电子器件。
主权项	A method, comprising: selecting a first optical substrate that includes a first planar optical waveguide, a first coupling facet situated on a beam propagation axis of the first optical waveguide, and a first spot size converter situated to optically couple the first coupling facet and the first planar optical waveguide; selecting a second optical substrate that includes a second planar optical waveguide, a second coupling facet situated on a beam propagation axis of the second optical waveguide, and a second spot size converter situated to optically couple the second coupling facet and the second planar optical waveguide; securing the second optical substrate with respect to the first optical substrate so as to optically couple the beam propagation axis of the first optical waveguide and the beam propagation axis of the second optical waveguide.
申请日期	2015-11-02
专利号	WO2016070186A1
专利状态	未确认
申请号	PCT/US2015/058643
公开（公告）号	WO2016070186A1
IPC 分类号	G02B6/24
专利代理人	JONES, MICHAEL, D.
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54638
专题	半导体激光器专利数据库
作者单位	KLAMKIN, JONATHAN
推荐引用方式 GB/T 7714	KLAMKIN, JONATHAN,RISTIC, SASA. Photonic integration by FLIP-chip bonding and spot-size conversion. WO2016070186A1[P]. 2016-05-06.