Apparatus and methods for micro-transfer printing

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	Apparatus and methods for micro-transfer printing
其他题名	Apparatus and methods for micro-transfer printing
	BOWER, CHRISTOPHER; MEITL, MATTHEW; KNEEBURG, DAVID; GOMEZ, DAVID; BONAFEDE, SALVATORE
	2016-03-24
专利权人	X-CELEPRINT LIMITED
公开日期	2016-03-24
授权国家	世界知识产权组织
专利类型	发明申请
摘要	An appartus and method for assembling a semiconductor device on a destination substrate using micro-transfer-printing is described. A conformable transfer device (102) such as an elastomer or visco-elastomer stamp includes an array of posts (114) for picking up printable semiconductor elements (104) from a native substrate (108) which is used for fabricating the printable semiconductor elements (104) and transferring the printable semiconductor elements (104) to a destination substrate (110). In certain embodiments, the printable semiconductor elements (104) are encapsulated in a polymer layer (106) before they are picked up. In certain embodiments a plasma treatment (e.g. atmospheric plasma) can be performed during micro transfer printing. The plasma can be applied to bottom surfaces of devices that are attached to an elastomer transfer-element. This treatment of bottom surfaces can be used to provide improved bonding between the devices and destination substrate, to clean the bottom surface of devices that have been fabricated using epitaxial lift-off methods, and to remove thin layers of oxides. In certain embodiments, if the devices have a backside metal, the semiconductor elements are printed to a destination substrate with mating metal pads that have been coated with a flux. After transferring the devices, the flux can be reflowed thereby leaving a good metal connection between the pads and the backside metal on the devices. In certain embodiments, the disclosed technology includes transfer devices designed to eliminate or reduce issues related to crowning. In certain embodiments, the crown is cut with a razor so that printable semiconductor elements are not picked up by the crown during a print operation.
其他摘要	描述了一种使用微转印在目的基板上组装半导体器件的装置和方法。诸如弹性体或粘弹性体印模的适形转移装置（102）包括柱（114）阵列，用于从用于制造可印刷半导体元件的原生基板（108）拾取可印刷半导体元件（104）（104）并将可印刷半导体元件（104）转移到目标基板（110）。在某些实施例中，可打印半导体元件（104）在被拾取之前被封装在聚合物层（106）中。在某些实施方案中，可以在微转印印刷期间进行等离子体处理（例如大气等离子体）。等离子体可以施加到附着到弹性体转移元件的装置的底表面上。这个底表面的处理可用于提供装置和目标基板之间的改进的结合，清洁使用外延剥离方法制造的装置的底表面，以及去除薄的氧化物层。在某些实施例中，如果器件具有背面金属，则半导体元件利用已涂有焊剂的配合金属焊盘印刷到目标基板。在转移器件之后，可以回流焊剂，从而在焊盘和器件上的背面金属之间留下良好的金属连接。在某些实施例中，所公开的技术包括设计用于消除或减少与隆起相关的问题的转移装置。在某些实施例中，用剃刀切割冠部，使得在印刷期间冠部不会拾取可印刷的半导体元件操作。
主权项	A method for assembling a semiconductor device on a receiving surface of a destination substrate, the method comprising: providing the semiconductor device formed on a native substrate; contacting a top surface of the semiconductor device with a conformable transfer device having a contact surface, wherein contact between the contact surface and the top surface of the semiconductor device at least temporarily binds the semiconductor device to the conformable transfer device; separating the semiconductor device from the native substrate such that the contact surface of the conformable transfer device has the semiconductor device disposed thereon with the semiconductor device released from the native substrate; prior to contacting the semiconductor device with the receiving surface of the destination substrate, exposing a backside surface of the semiconductor device to a plasma (e.g., atmospheric plasma) following separation from the native substrate; contacting the semiconductor device disposed on the contact surface with the receiving surface of the destination substtate; and separating the contact surface of the conformable transfer device from the semiconductor device, thereby assembling the semiconductor device on the receiving surface of the destination substrate.
申请日期	2015-07-20
专利号	WO2016012409A3
专利状态	未确认
申请号	PCT/EP2015/066566
公开（公告）号	WO2016012409A3
IPC 分类号	H01L21/683 \| H01L21/58 \| H01L21/98 \| H01L23/31
专利代理人	KIRKHAM, NICHOLAS ET AL.
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54608
专题	半导体激光器专利数据库
作者单位	X-CELEPRINT LIMITED
推荐引用方式 GB/T 7714	BOWER, CHRISTOPHER,MEITL, MATTHEW,KNEEBURG, DAVID,et al. Apparatus and methods for micro-transfer printing. WO2016012409A3[P]. 2016-03-24.

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