Package substrate, package, and electronic device

OPT OpenIR > 半导体激光器专利数据库

	Package substrate, package, and electronic device
其他题名	Package substrate, package, and electronic device
	MITSUI, YOKO; TAKEDA, SATOSHI
	2015-12-31
专利权人	ASAHI GLASS COMPANY, LIMITED
公开日期	2015-12-31
授权国家	美国
专利类型	发明申请
摘要	A package substrate includes a recessed part and a step part disposed at a periphery thereof, and a lid body is bonded to the step part to cover the recessed part via a bonding layer containing a glass and an electromagnetic wave absorbent material. A ratio (w1/h1) of a width (w1) to a height (h1) of the step part of the package substrate is 0 or more.
其他摘要	封装基板包括凹陷部分和设置在其周边的台阶部分，盖子主体通过包含玻璃和电磁波吸收材料的粘合层粘合到台阶部分以覆盖凹陷部分。宽度（w 1 ）与高度（h 1 ）的比率（w 1 / h 1 ））封装基板的台阶部分为0或更大。
主权项	A package substrate, comprising: a recessed part; and a step part disposed at a periphery of the recessed part, wherein a lid body is bonded to the step part to cover the recessed part via a bonding layer containing a glass and an electromagnetic wave absorbent material, wherein a ratio (w1/h1) of a width (w1) to a height (h1) of the step part is 0 or more.
申请日期	2015-06-12
专利号	US20150380330A1
专利状态	失效
申请号	US14/738018
公开（公告）号	US20150380330A1
IPC 分类号	H01L23/053 \| H05K1/02 \| H01L23/08 \| H01L33/48 \| H01L41/053
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54593
专题	半导体激光器专利数据库
作者单位	ASAHI GLASS COMPANY, LIMITED
推荐引用方式 GB/T 7714	MITSUI, YOKO,TAKEDA, SATOSHI. Package substrate, package, and electronic device. US20150380330A1[P]. 2015-12-31.