Method for Producing an Optoelectronic Semiconductor Device, and Optoelectronic Semiconductor Device

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	Method for Producing an Optoelectronic Semiconductor Device, and Optoelectronic Semiconductor Device
其他题名	Method for Producing an Optoelectronic Semiconductor Device, and Optoelectronic Semiconductor Device
	PREUSTEPHAN; ZITZLSPERGER, MICHAEL; KISTNER, CAROLINE
	2015-11-19
专利权人	OSRAM OPTO SEMICONDUCTORS GMBH
公开日期	2015-11-19
授权国家	美国
专利类型	发明申请
摘要	A method for producing an optoelectronic thin-film chip semiconductor device is specified. A conductor structure is applied on a carrier and a multiplicity of optoelectronic semiconductor chips are arranged between the conductor structures. Each of the optoelectronic semiconductor chips includes a layer at a top side. Furthermore, electrical connections between semiconductor chip and the conductor structure are established, for instance using a bonding wire. The semiconductor chips and the conductor structure are surrounded with a molded body. The molded body does not project beyond the optoelectronic semiconductor chips at the top side thereof facing away from the carrier. Moreover, the carrier is removed and the semiconductor chips surrounded by molding are singulated.
其他摘要	提出了一种制造光电薄膜芯片半导体器件的方法。导体结构施加在载体上，并且多个光电子半导体芯片布置在导体结构之间。每个光电子半导体芯片包括顶侧的层。此外，例如使用接合线建立半导体芯片和导体结构之间的电连接。半导体芯片和导体结构被模制体包围。模制体在其远离载体的顶侧处不突出超过光电子半导体芯片。此外，移除载体并将由模制包围的半导体芯片单个化。
主权项	15. A method for producing an optoelectronic semiconductor component, the method comprising: arranging a conductor structure on an upper side of a carrier, wherein the conductor structure comprises an electrically conductive material and has a plurality of openings and wherein the upper side of the carrier is exposed through the openings of the conductor structure; arranging a plurality of optoelectronic semiconductor chips on the upper side of the carrier in the openings of the conductor structure, wherein each optoelectronic semiconductor chip comprises a layer at an upper side of the respective semiconductor chip; forming an electrical connection between a terminal point of each optoelectronic semiconductor chip and the conductor structure; molding a molded body around each optoelectronic semiconductor chip and each electrical connection, wherein the molded body at least partially covers lateral surfaces of all optoelectronic semiconductor chips, and wherein the molded body does not extend beyond the optoelectronic semiconductor chips on the upper side of the chips facing away from the carrier; removing the carrier; and singulating the molded body to create plurality of optoelectronic semiconductor components, wherein each optoelectronic semiconductor component comprises at least one optoelectronic semiconductor chip.
申请日期	2013-12-17
专利号	US20150333232A1
专利状态	授权
申请号	US14/654500
公开（公告）号	US20150333232A1
IPC 分类号	H01L33/48 \| H01L33/60 \| H01L33/62 \| H01L33/54
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54476
专题	半导体激光器专利数据库
作者单位	OSRAM OPTO SEMICONDUCTORS GMBH
推荐引用方式 GB/T 7714	PREUSTEPHAN,ZITZLSPERGER, MICHAEL,KISTNER, CAROLINE. Method for Producing an Optoelectronic Semiconductor Device, and Optoelectronic Semiconductor Device. US20150333232A1[P]. 2015-11-19.