Light source package and method of manufacturing the same

OPT OpenIR > 半导体激光器专利数据库

	Light source package and method of manufacturing the same
其他题名	Light source package and method of manufacturing the same
	ABDUL KARIM, NORFIDATHUL AIZAR; LEE, CHIAU JIN; TAN, KHENG LENG
	2014-12-04
专利权人	AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
公开日期	2014-12-04
授权国家	美国
专利类型	发明申请
摘要	A package for a light source is disclosed. In particular, a Plastic Leaded Chip Carrier (PLCC) is described which provides enhanced heat dissipating properties. Moreover, the PLCC is described as comprising a single-gage leadframe, which provides for enhanced design flexibility and reduced manufacturing costs. Methods of manufacturing light source packages are also disclosed.
其他摘要	公开了一种用于光源的封装。特别地，描述了一种塑料引线芯片载体（PLCC），其提供增强的散热性能。此外，PLCC被描述为包括单规格引线框架，其提供增强的设计灵活性和降低的制造成本。还公开了制造光源封装的方法。
主权项	An optical device, comprising: a single-gage leadframe comprising a bonding pad having a top surface and an opposing bottom surface, a first conductive lead, and a second conductive lead, wherein at least one of the first and second conductive leads comprise a stitch pad configured for wire bonding that is elevated relative to the top surface of the boding pad; a non-conductive housing that physically separates the bonding pad from both the first conductive lead and the second conductive lead as well, at least a portion of the bonding pad bottom surface being exposed through a bottom face of the housing, and at least a portion of the stitch pad being exposed through the housing; and a light source mounted to the top surface of the bonding pad.
申请日期	2013-06-03
专利号	US20140353701A1
专利状态	授权
申请号	US13/908860
公开（公告）号	US20140353701A1
IPC 分类号	H01L33/62 \| H01L33/60
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54437
专题	半导体激光器专利数据库
作者单位	AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
推荐引用方式 GB/T 7714	ABDUL KARIM, NORFIDATHUL AIZAR,LEE, CHIAU JIN,TAN, KHENG LENG. Light source package and method of manufacturing the same. US20140353701A1[P]. 2014-12-04.