Adhesive substance, in particular for encapsulating an electronic assembly

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	Adhesive substance, in particular for encapsulating an electronic assembly
其他题名	Adhesive substance, in particular for encapsulating an electronic assembly
	DOLLASE, THILO; KRAWINKEL, THORSTEN; BAI, MINYOUNG
	2014-10-23
专利权人	TESA SE
公开日期	2014-10-23
授权国家	美国
专利类型	发明申请
摘要	An adhesive and method for encapsulating an electronic arrangement with respect to permeants, wherein the adhesive and method have (a) at least one copolymer comprising at least isobutylene or butylene as comonomer kind and at least one comonomer kind which, considered as hypothetical homopolymer, has a softening temperature of greater than 40° C., (b) at least one kind of an at least partly hydrogenated tackifier resin, (c) at least one kind of a reactive resin based on cyclic ethers having a softening temperature of less than 40° C., preferably less than 20° C., and (d) at least one kind of a photoinitiator for initiating cationic curing
其他摘要	一种粘合剂和用于封装电子装置相对于渗透物的方法，其中所述粘合剂和方法具有（a）至少一种共聚物，所述共聚物包含至少异丁烯或丁烯作为共聚单体类型和至少一种共聚单体类型，其被认为是假设的均聚物，具有软化温度大于40℃，（b）至少一种至少部分氢化的增粘树脂，（c）至少一种基于环醚的反应性树脂，其软化温度小于40℃ °C，优选低于20℃，和（d）至少一种用于引发阳离子固化的光引发剂
主权项	An adhesive for encapsulating an electronic arrangement, the adhesive comprising(a) at least one copolymer comprising at least isobutylene or butylene as comonomer kind and at least one comonomer kind which has a softening temperature of greater than 40° C.,(b) at least one kind of an at least partly hydrogenated tackifier resin,(c) at least one kind of a reactive resin based on cyclic ethers having a softening temperature of less than 40° C., and(d) at least one kind of a photoinitiator for initiating cationic curing.
申请日期	2012-10-19
专利号	US20140315016A1
专利状态	失效
申请号	US14/351800
公开（公告）号	US20140315016A1
IPC 分类号	H01L23/29 \| C09J7/02 \| C09J153/00
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54380
专题	半导体激光器专利数据库
作者单位	TESA SE
推荐引用方式 GB/T 7714	DOLLASE, THILO,KRAWINKEL, THORSTEN,BAI, MINYOUNG. Adhesive substance, in particular for encapsulating an electronic assembly. US20140315016A1[P]. 2014-10-23.