Silicon carrier optoelectronic packaging

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	Silicon carrier optoelectronic packaging
其他题名	Silicon carrier optoelectronic packaging
	ANDRY, PAUL S.; BUDD, RUSSELL A.; DANG, BING; DANOVITCH, DAVID; FASANO, BENJAMIN V.; FORTIER, PAUL; GUERIN, LUC; LIBSCH, FRANK R.; OUIMET, SYLVAIN; PATEL, CHRIRAG S.
	2012-12-27
专利权人	GLOBALFOUNDRIES INC.
公开日期	2012-12-27
授权国家	美国
专利类型	发明申请
摘要	An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with wiring. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. A plurality of OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the OE elements positioned in optical alignment with the optical via for receiving the light. A carrier is interposed between electrical interconnect elements. The carrier is positioned between the wiring of the silicon layer and a circuit board and the carrier is electrically connecting first interconnect elements connected to the wiring of the silicon layer and second interconnect elements connected to the circuit board.
其他摘要	公开了一种用于制造的光电（OE）封装或系统和方法，其包括具有布线的硅层。硅层具有光学通孔，用于允许光通过。光学耦合层结合到硅层，并且光学耦合层包括多个微透镜，用于通过光学通孔聚焦和/或准直光。多个OE元件耦合到硅层并与布线电连通。至少一个OE元件与光学通孔光学对准，用于接收光。载体插入在电互连元件之间。载体位于硅层的布线和电路板之间，载体电连接连接到硅层的布线的第一互连元件和连接到电路板的第二互连元件。
主权项	An optoelectronic (OE) assembly for a semiconductor or computer chip, comprising: a silicon layer with wiring, the silicon layer defining at least one optical via for allowing light to pass therethrough; an optical coupling layer bonded to the silicon layer, the optical coupling layer including a plurality of microlenses for focusing and or collimating the light through the optical via; a plurality of OE elements coupled to the silicon layer and electrically communicating with the wiring, at least one of the OE elements positioned in optical alignment with the optical via for receiving the light; and a carrier and thermal sink interposer positioned over the OE elements and in thermal contact with the OE elements.
申请日期	2012-09-05
专利号	US20120326290A1
专利状态	授权
申请号	US13/604341
公开（公告）号	US20120326290A1
IPC 分类号	H01L23/34 \| H01L21/50
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54366
专题	半导体激光器专利数据库
作者单位	GLOBALFOUNDRIES INC.
推荐引用方式 GB/T 7714	ANDRY, PAUL S.,BUDD, RUSSELL A.,DANG, BING,et al. Silicon carrier optoelectronic packaging. US20120326290A1[P]. 2012-12-27.