Xi'an Institute of Optics and Precision Mechanics,CAS
N-type gallium-nitride layer having multiple conductive intervening layers | |
其他题名 | N-type gallium-nitride layer having multiple conductive intervening layers |
CHEN, ZHEN; FU, YI | |
2013-02-07 | |
专利权人 | KABUSHIKI KAISHA TOSHIBA |
公开日期 | 2013-02-07 |
授权国家 | 美国 |
专利类型 | 发明申请 |
摘要 | A vertical GaN-based blue LED has an n-type layer comprising multiple conductive intervening layers. The n-type layer contains a plurality of periods. Each period of the n-type layer includes a gallium-nitride (GaN) sublayer and a thin conductive aluminum-gallium-nitride (AlGaN:Si) intervening sublayer. In one example, each GaN sublayer has a thickness substantially more than 100 nm and less than 1000 nm, and each AlGaN:Si intervening sublayer has a thickness less than 25 nm. The entire n-type layer is at least 2000 nm thick. The AlGaN:Si intervening layer provides compressive strain to the GaN sublayer thereby preventing cracking. After the epitaxial layers of the LED are formed, a conductive carrier is wafer bonded to the structure. The silicon substrate is then removed. Electrodes are added and the structure is singulated to form a finished LED device. Because the AlGaN:Si sublayers are conductive, the entire n-type layer can remain as part of the finished LED device. |
其他摘要 | 垂直GaN基蓝色LED具有包括多个导电中间层的n型层。 n型层包含多个周期。 n型层的每个周期包括氮化镓(GaN)子层和薄的导电铝 - 氮化镓(AlGaN:Si)插入子层。在一个示例中,每个GaN子层具有基本上大于100nm且小于1000nm的厚度,并且每个AlGaN:Si介入子层具有小于25nm的厚度。整个n型层的厚度至少为2000nm。 AlGaN:Si插入层为GaN子层提供压缩应变,从而防止开裂。在形成LED的外延层之后,将导电载体晶片接合到该结构。然后除去硅衬底。添加电极并将结构单个化以形成成品LED器件。因为AlGaN:Si子层是导电的,所以整个n型层可以保留为成品LED器件的一部分。 |
主权项 | A method of manufacturing a Light Emitting Diode (LED) device, comprising:(a) forming an n-type layer over a silicon substrate, wherein the n-type layer comprises a plurality of periods, wherein each period of the n-type layer includes a gallium-nitride (GaN) sublayer and an aluminum-gallium-nitride doped with silicon (AlGaN:Si) intervening sublayer layer;(b) forming an active layer over the n-type layer, wherein the active layer includes an amount of indium; and(c) forming a p-type layer over the active layer such that the silicon substrate, the n-type layer, the active layer, and the p-type layer form a first structure. |
申请日期 | 2011-08-02 |
专利号 | US20130032836A1 |
专利状态 | 授权 |
申请号 | US13/196828 |
公开(公告)号 | US20130032836A1 |
IPC 分类号 | H01L33/32 | H01L33/58 |
专利代理人 | - |
代理机构 | - |
文献类型 | 专利 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/54254 |
专题 | 半导体激光器专利数据库 |
作者单位 | KABUSHIKI KAISHA TOSHIBA |
推荐引用方式 GB/T 7714 | CHEN, ZHEN,FU, YI. N-type gallium-nitride layer having multiple conductive intervening layers. US20130032836A1[P]. 2013-02-07. |
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