Die-bonding material for optical semiconductor devices and optical semiconductor device using same

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	Die-bonding material for optical semiconductor devices and optical semiconductor device using same
其他题名	Die-bonding material for optical semiconductor devices and optical semiconductor device using same
	NISHIMURA, TAKASHI; WATANABE, TAKASHI
	2013-04-17
专利权人	SEKISUI CHEMICAL CO., LTD.
公开日期	2013-04-17
授权国家	欧洲专利局
专利类型	发明申请
摘要	The present invention provides a die bonding material for an optical semiconductor device which has high thermal conductivity and can prevent cracking in an optical semiconductor device including the die bonding material. The die bonding material for an optical semiconductor device includes: a first silicone resin containing a hydrogen atom bonded to a silicon atom, a second silicone resin not containing a hydrogen atom bonded to a silicon atom, but containing an alkenyl group, a catalyst for hydrosilylation reaction, and at least one substance selected from the group consisting of anhydrous magnesium carbonate represented by chemical formula MgCO3 not containing crystal water and coated bodies including the anhydrous magnesium carbonate and an organic resin, a silicone resin, or silica coated on the surface thereof.
其他摘要	本发明提供一种用于光学半导体器件的管芯键合材料，其具有高导热率并且可以防止包括管芯键合材料的光学半导体器件中的裂缝。用于光学半导体器件的管芯键合材料包括：第一硅树脂，其包含与硅原子键合的氢原子，第二硅树脂，其不包含与硅原子键合的氢原子，但包含烯基，用于氢化硅烷化的催化剂反应，和选自由不含结晶水的化学式MgCO3表示的无水碳酸镁和包含无水碳酸镁和有机树脂的涂覆体，硅氧烷树脂或涂覆在其表面上的二氧化硅中的至少一种物质。
主权项	A die bonding material for an optical semiconductor device, comprising a first silicone resin containing a hydrogen atom bonded to a silicon atom, a second silicone resin not containing a hydrogen atom bonded to a silicon atom, but containing an alkenyl group, a catalyst for hydrosilylation reaction, and at least one substance selected from the group consisting of anhydrous magnesium carbonate represented by chemical formula MgCO 3 not containing crystal water and coated body, said anhydrous magnesium represented by chemical formula MgCO 3, said coated body including the anhydrous magnesium carbonate and an organic resin, a silicone resin, or silica coated on the surface thereof.
申请日期	2011-06-07
专利号	EP2581954A1
专利状态	失效
申请号	EP2011792439
公开（公告）号	EP2581954A1
IPC 分类号	H01L33/48 \| C08K3/26 \| C08L83/05 \| C08L83/07 \| H01L21/52 \| C09J183/04
专利代理人	-
代理机构	MERKLE, GEBHARD
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54241
专题	半导体激光器专利数据库
作者单位	SEKISUI CHEMICAL CO., LTD.
推荐引用方式 GB/T 7714	NISHIMURA, TAKASHI,WATANABE, TAKASHI. Die-bonding material for optical semiconductor devices and optical semiconductor device using same. EP2581954A1[P]. 2013-04-17.