Conduction cooled package laser and packaging method for forming the same

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	Conduction cooled package laser and packaging method for forming the same
其他题名	Conduction cooled package laser and packaging method for forming the same
	OU, SZUTSUN SIMON; HSIAO, PO-WEN; HSIEH, CHIA-HUNG; YANG, HUI-PING; HSU, YING-FENG
	2012-04-05
专利权人	ARIMA LASERS CORP.
公开日期	2012-04-05
授权国家	美国
专利类型	发明申请
摘要	A packaging method for forming a conduction cooled package (CCP) laser is provided and includes soldering a semiconductor laser device on the first heat spreader; and then bonding the first heat spreader on the second spreader via an Al/Ni nano-laminated foil. Moreover, a CCP laser is also provided herein.
其他摘要	提供一种用于形成传导冷却封装（CCP）激光器的封装方法，包括将半导体激光器件焊接在第一散热器上;然后通过Al / Ni纳米层压箔将第一散热器粘接在第二个散热器上。此外，本文还提供了CCP激光器。
主权项	A packaging method of a conduction cooled package (CCP) laser, comprising: providing a semiconductor laser device; soldering the semiconductor laser device on a first heat spreader; and bonding the first heat spreader to a second, heat spreader via an Al/Ni nano-laminated foil.
申请日期	2011-03-28
专利号	US20120082176A1
专利状态	失效
申请号	US13/072793
公开（公告）号	US20120082176A1
IPC 分类号	H01S3/04 \| H01L33/48
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/54221
专题	半导体激光器专利数据库
作者单位	ARIMA LASERS CORP.
推荐引用方式 GB/T 7714	OU, SZUTSUN SIMON,HSIAO, PO-WEN,HSIEH, CHIA-HUNG,et al. Conduction cooled package laser and packaging method for forming the same. US20120082176A1[P]. 2012-04-05.