A semiconductor light-emitting module

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	A semiconductor light-emitting module
其他题名	A semiconductor light-emitting module
	CHEN, JEN-SHYAN
	2008-04-17
专利权人	NEOBULB TECHNOLOGIES, INC.
公开日期	2008-04-17
授权国家	澳大利亚
专利类型	发明申请
摘要	The invention provides a semiconductor high-power light-emitting module including a heat-dissipating member, a heat-conducting device, and a diode light-emitting device. The heat-dissipating member includes an isolator member coupled to a first side of the heat-dissipating member. The heat-dissipating member has a second side opposite to the first side. The isolator member has a third side opposite to the first side. The environment temperature at the third side is higher than that at the second side. The heat-conducting device has a flat end and a contact portion tightly mounted on the heat-dissipating member. The diode light-emitting device is disposed on the flat end of the heat-conducting device. The semiconductor light-emitting module of the invention, applied to a headlamp of an automobile, has properties of saving electricity and long life, and furthermore the capability of integrating the heat-dissipating member into a shell of the automobile is both artistic and practical.
其他摘要	本发明提供一种半导体大功率发光模块，包括散热构件，导热装置和二极管发光装置。散热构件包括连接到散热构件的第一侧的隔离构件。散热构件具有与第一侧相对的第二侧。隔离器构件具有与第一侧相对的第三侧。第三侧的环境温度高于第二侧的环境温度。导热装置具有平端和紧密安装在散热构件上的接触部分。二极管发光装置设置在导热装置的平坦端上。本发明的半导体发光模块应用于汽车前照灯，具有省电，寿命长的特点，而且将散热件集成到汽车外壳中的能力既美观又实用。
主权项	A semiconductor light-emitting module, comprising: a heat-dissipating member having an isolator member coupled to a first side of the heat-dissipating member, the heat-dissipating member having a second side opposite to the first side, the isolator member having a third side opposite to the first side; a heat-conducting device having a flat end and a contact portion, the contact portion being disposed between the heat-dissipating member and the isolator member and mounted on the heat-dissipating member; and a diode light-emitting device, a bottom of the diode light-emitting device being mounted on the flat end of the heat-conducting device.
申请日期	2006-10-10
专利号	AU2006349349A1
专利状态	失效
申请号	AU2006349349
公开（公告）号	AU2006349349A1
IPC 分类号	F21W \| H01L \| F21V29/00 \| H01L33/00 \| H01L23/34 \| F21V \| F21W101/10
专利代理人	-
代理机构	A.P.T. PATENT AND TRADE MARK ATTORNEYS
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/53858
专题	半导体激光器专利数据库
作者单位	NEOBULB TECHNOLOGIES, INC.
推荐引用方式 GB/T 7714	CHEN, JEN-SHYAN. A semiconductor light-emitting module. AU2006349349A1[P]. 2008-04-17.