Diode-pumped, solid-state laser with chip-shaped laser medium and heat sink

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	Diode-pumped, solid-state laser with chip-shaped laser medium and heat sink
其他题名	Diode-pumped, solid-state laser with chip-shaped laser medium and heat sink
	SUN, YUNLONG; BAIRD, BRIAN
	2007-02-22
专利权人	ELECTRO SCIENTIFIC INDUSTRIES, INC.
公开日期	2007-02-22
授权国家	世界知识产权组织
专利类型	发明申请
摘要	A chip-shaped laser medium (12) is side pumped to improve mode matching between the pumping energy (50) and lasing mode volume (36). The chip thickness (44) and laser medium doping level can be designed and controlled to ensure adequate pumping coupling efficiency. The chip shape can also be employed to provide greater chip surface areas (22) for cooling the laser medium (12). The laser pumping package (70), gain module (101), and chip-shaped design can be scalable to offer higher pumping power and high output power. Different orientations of the gain modules (101) with respect to each other can be used to provide better lasing mode quality.
其他摘要	侧向泵浦芯片形激光介质（12）以改善泵浦能量（50）和激光模式体积（36）之间的模式匹配。可以设计和控制芯片厚度（44）和激光介质掺杂水平，以确保足够的泵浦耦合效率。芯片形状也可用于提供更大的芯片表面区域（22），用于冷却激光介质（12）。激光泵浦封装（70），增益模块（101）和芯片形设计可以是可扩展的，以提供更高的泵浦功率和高输出功率。增益模块（101）相对于彼此的不同取向可用于提供更好的激光模式质量。
主权项	A solid-state laser, comprising: a chip-shaped, solid-state laser medium having side surfaces that are transverse to and adjoin two generally planar opposing first and second chip faces, each chip face having a face surface area that is greater than a side surface area of any one of the side surfaces, and the solid-state laser medium being adapted to emit solid-state laser output through at least one of the side surfaces in response to laser pumping light introduced through at least one of its chip faces; a first heat sink having a first heat sink surface in contact with the first chip face such that a first major portion of the surface area of the first chip face contacts the first heat sink surface; a pumping source for providing laser pumping light; an optical unit for directing the pumping light generally toward and transverse to the second face; and a second heat sink having a second heat sink surface in contact with the second chip face such that a second major portion of the surface area of the second chip face contacts the second heat sink surface, the second heat sink adapted to permit passage of the laser pumping light to impinge the second chip face.
申请日期	2006-06-19
专利号	WO2007002019A3
专利状态	未确认
申请号	PCT/US2006/023880
公开（公告）号	WO2007002019A3
IPC 分类号	H01S3/042 \| H01S3/42
专利代理人	LEVINE, MICHAEL, L.
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/53813
专题	半导体激光器专利数据库
作者单位	ELECTRO SCIENTIFIC INDUSTRIES, INC.
推荐引用方式 GB/T 7714	SUN, YUNLONG,BAIRD, BRIAN. Diode-pumped, solid-state laser with chip-shaped laser medium and heat sink. WO2007002019A3[P]. 2007-02-22.

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