High power LED package and fabrication method thereof

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	High power LED package and fabrication method thereof
其他题名	High power LED package and fabrication method thereof
	LEE, SEON GOO; HAHM, HUN JOO; PARK, JUNG KYU; HAN, KYUNG TAEG; HAN, SEONG YEON; KIM, DAE YEON; PARK, YOUNG SAM
	2006-12-07
专利权人	SAMSUNG ELECTRONICS CO., LTD.
公开日期	2006-12-07
授权国家	美国
专利类型	发明申请
摘要	An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.
其他摘要	LED二极管封装包括：热连接部分，用于在其上表面上安装发光部分;框架，电连接到发光部分，同时保持热连接部分;以及模制部件，将热连接部分和框架固定在一起。发光部分响应于施加到其上的电流而产生光，并且热连接部分的上表面突出超过模制部分的上表面到预定高度。这可以优化光源的独特光束角度，从而最大化照明效率以及防止封装材料在透镜的组装过程中溢出，否则可能污染相邻的部件。
主权项	A high -power light emitting diode package comprising: a heat connecting part for mounting a light emitting part on an upper surface thereof, the light emitting part generating light in response to current applied thereto; frames electrically connected to the light emitting part while holding the heat connecting part; and a molded part fixing the heat connecting part and the frames together, wherein the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height so that the upper surface of the heat connecting part is positioned higher than the upper surface of the molded part.
申请日期	2006-06-02
专利号	US20060273338A1
专利状态	授权
申请号	US11/445227
公开（公告）号	US20060273338A1
IPC 分类号	H01L33/00 \| H01L33/56 \| H01L33/58 \| H01L33/62 \| H01L33/64
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/53808
专题	半导体激光器专利数据库
作者单位	SAMSUNG ELECTRONICS CO., LTD.
推荐引用方式 GB/T 7714	LEE, SEON GOO,HAHM, HUN JOO,PARK, JUNG KYU,et al. High power LED package and fabrication method thereof. US20060273338A1[P]. 2006-12-07.