Xi'an Institute of Optics and Precision Mechanics,CAS
| Semiconductor packaging structure | |
| 其他题名 | Semiconductor packaging structure |
| WONG, DAW-HENG; HUNG, SHR-HAU; YING, TSUNG-KANG | |
| 2007-01-04 | |
| 专利权人 | LITE-ON TECHNOLOGY CORPORATION |
| 公开日期 | 2007-01-04 |
| 授权国家 | 美国 |
| 专利类型 | 发明申请 |
| 摘要 | A semiconductor packaging structure includes a baseboard, a semiconductor chip set, a thermal conductor, a package and a heat sink. The thermal conductor is located on the baseboard. The semiconductor chip set is directly mounted onto the thermal conductor. The heat sink is coupled on the thermal conductor. Hence heat energy generated by the semiconductor chip set, when electrically energized, is transferred through the thermal conductor to the heat sink, to perform heat exchange. |
| 其他摘要 | 一种半导体封装结构，包括基板，半导体芯片组，热导体，封装和散热器。热导体位于基板上。半导体芯片组直接安装在热导体上。散热器耦合在热导体上。因此，半导体芯片组产生的热能在通电时通过热导体传递到散热器，以进行热交换。 |
| 主权项 | A semiconductor packaging structure, comprising: a baseboard; a thermal conductor located on the baseboard; at least one semiconductor chip set mounted onto the thermal conductor; a plurality of conductive blades located on the bottom of the baseboard connecting electrically to the semiconductor chip set through a plurality of conductive leads; a package encasing the semiconductor chip set; and a heat sink coupling with the thermal conductor to perform heat exchange for heat energy generated by the semiconductor chip set and transferred through the thermal conductor. |
| 申请日期 | 2005-11-17 |
| 专利号 | US20070001290A1 |
| 专利状态 | 失效 |
| 申请号 | US11/280198 |
| 公开（公告）号 | US20070001290A1 |
| IPC 分类号 | H01L23/34 |
| 专利代理人 | - |
| 代理机构 | - |
| 文献类型 | 专利 |
| 条目标识符 | http://ir.opt.ac.cn/handle/181661/53748 |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | LITE-ON TECHNOLOGY CORPORATION |
| 推荐引用方式 GB/T 7714 | WONG, DAW-HENG,HUNG, SHR-HAU,YING, TSUNG-KANG. Semiconductor packaging structure. US20070001290A1[P]. 2007-01-04. |
| 条目包含的文件 | 条目无相关文件。 | |||||
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