Epoxy-silicone mixed resin composition and light-emitting semiconductor device

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	Epoxy-silicone mixed resin composition and light-emitting semiconductor device
其他题名	Epoxy-silicone mixed resin composition and light-emitting semiconductor device
	KASHIWAGI, TSUTOMU; SHIOBARA, TOSHIO
	2005-11-03
专利权人	SHIN-ETSU CHEMICAL CO., LTD.
公开日期	2005-11-03
授权国家	美国
专利类型	发明申请
摘要	An epoxy-silicone mixed resin composition to give a transparent cured product which comprises [I] 100 parts by weight of a curable resin composition containing an organosilicon compound and an epoxy resin as essential components, and [II] 0.1 to 50 parts by weight of a silicone elastomer having a refractive index within 10% of that of a cured product of the curable resin composition. It is suitable for use as an encapsulator for light-emitting semiconductors.
其他摘要	一种环氧 - 硅氧烷混合树脂组合物，其提供透明的固化产物，其包含[I] 100重量份的含有有机硅化合物和环氧树脂作为必要组分的可固化树脂组合物，和[II] 0.1至50重量份的硅氧烷弹性体，其折射率在可固化树脂组合物的固化产物的10％以内。它适合用作发光半导体的封装器。
主权项	An epoxy-silicone mixed resin composition which is cured into a transparent cured product comprising: [I] 100 parts by weight of a curable resin composition containing an organosilicon compound and an epoxy resin as essential components, and [II] 0.1 to 50 parts by weight of a silicone elastomer having a refractive index within 10% of that of a cured product of said curable resin composition.
申请日期	2005-04-28
专利号	US20050244649A1
专利状态	授权
申请号	US11/116295
公开（公告）号	US20050244649A1
IPC 分类号	C08L63/00 \| B32B27/38 \| C08G59/40 \| C08L83/04 \| H01L33/48 \| H01L33/56 \| H01S5/022
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/53636
专题	半导体激光器专利数据库
作者单位	SHIN-ETSU CHEMICAL CO., LTD.
推荐引用方式 GB/T 7714	KASHIWAGI, TSUTOMU,SHIOBARA, TOSHIO. Epoxy-silicone mixed resin composition and light-emitting semiconductor device. US20050244649A1[P]. 2005-11-03.