Light emission device and manufacturing method thereof

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	Light emission device and manufacturing method thereof
其他题名	Light emission device and manufacturing method thereof
	MIZUYOSHI, AKIRA
	2005-03-17
专利权人	FUJI PHOTO FILM CO., LTD.
公开日期	2005-03-17
授权国家	美国
专利类型	发明申请
摘要	A light emission device is constituted of LED chips, a driver circuit, and a wiring pattern for connecting the individual LED chips to the driver circuit. The wiring pattern is formed by weaving line members into a cross grid, the line member being formed by coating an electro conductive core with an isolating material. The lateral line members are connected to a negative electrode of the driver circuit, while the longitudinal line members are connected to a positive electrode of the driver circuit. Connectors are formed at cross points between the line members Negative poles of the LED chips are connected to the connectors that are formed on the lateral line members, while positive poles of the LED chips are connected to the connectors that are formed on the longitudinal line members. The wiring pattern is affixed to a heat sink through an adhesive agent.
其他摘要	发光装置由LED芯片，驱动电路和用于将各个LED芯片连接到驱动电路的布线图案构成。通过将线构件编织成十字格栅来形成布线图案，线构件通过用隔离材料涂覆导电芯而形成。横向线构件连接到驱动电路的负电极，而纵向线构件连接到驱动电路的正电极。连接器形成在线路构件之间的交叉点处LED芯片的负极连接到形成在横向线构件上的连接器，而LED芯片的正极连接到形成在纵向线构件上的连接器。布线图案通过粘合剂固定到散热器上。
主权项	A light emission device comprising a plural number of light emitting elements, a driver circuit for driving said light emitting elements, and a wiring pattern for connecting said driver circuit electrically to said light emitting elements, said light emission device comprising: a plural number of line members constituting said wiring pattern, each of said line members being formed by coating an electro conductive core with an isolating material; and connectors formed by cutting away said isolating material partially from each of said line members so as to expose said core partly, said connectors being connected to respective poles of said light emitting elements.
申请日期	2004-09-14
专利号	US20050057939A1
专利状态	失效
申请号	US10/939362
公开（公告）号	US20050057939A1
IPC 分类号	G09F9/30 \| G09F9/00 \| G09F9/33 \| H01L25/075 \| H01L33/56 \| H01L33/62 \| H01L33/64 \| F21V21/06
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/53432
专题	半导体激光器专利数据库
作者单位	FUJI PHOTO FILM CO., LTD.
推荐引用方式 GB/T 7714	MIZUYOSHI, AKIRA. Light emission device and manufacturing method thereof. US20050057939A1[P]. 2005-03-17.