Xi'an Institute of Optics and Precision Mechanics,CAS
| Light emitting device assembly | |
| 其他题名 | Light emitting device assembly |
| KWAK, JOON-SEOP; KIM, JONG-WAN; CHAE, SU-HEE | |
| 2005-04-07 | |
| 专利权人 | SAMSUNG ELECTRONICS CO., LTD. |
| 公开日期 | 2005-04-07 |
| 授权国家 | 美国 |
| 专利类型 | 发明申请 |
| 摘要 | Provided is a light emitting device assembly. The light emitting device assembly includes a submount including bumps, each having a bonded surface and a lateral surface surrounding the bonded surface; and a light emitting device including pads, each having a bonded surface corresponding to a bonded surface of a corresponding bump. Herein, edges of the bonded surface of each of the bumps are spaced a predetermined distance inward from edges of a corresponding pad. |
| 其他摘要 | 提供一种发光器件组件。发光器件组件包括具有凸块的子安装座，每个凸块具有结合表面和围绕结合表面的侧表面;和包括焊盘的发光器件，每个焊盘具有对应于相应凸块的接合表面的接合表面。这里，每个凸块的结合表面的边缘与相应焊盘的边缘向内隔开预定距离。 |
| 主权项 | A light emitting device assembly comprising: a submount including bumps, each having a bonded surface and a lateral surface surrounding the bonded surface; and a light emitting device including pads, each having a bonded surface corresponding to a bonded surface of a corresponding bump, wherein edges of the bonded surface of each of the bumps are spaced a predetermined distance inward from edges of a corresponding pad. |
| 申请日期 | 2004-09-13 |
| 专利号 | US20050072984A1 |
| 专利状态 | 授权 |
| 申请号 | US10/938556 |
| 公开（公告）号 | US20050072984A1 |
| IPC 分类号 | H01L21/60 | H01L23/48 | H01L33/32 | H01L33/62 | H01L33/64 | H01S5/02 | H01S5/022 | H01S5/323 | H05K3/32 | H01L33/00 |
| 专利代理人 | - |
| 代理机构 | - |
| 文献类型 | 专利 |
| 条目标识符 | http://ir.opt.ac.cn/handle/181661/53428 |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SAMSUNG ELECTRONICS CO., LTD. |
| 推荐引用方式 GB/T 7714 | KWAK, JOON-SEOP,KIM, JONG-WAN,CHAE, SU-HEE. Light emitting device assembly. US20050072984A1[P]. 2005-04-07. |
| 条目包含的文件 | 条目无相关文件。 | |||||
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