Low thermal expansion coefficient cooler for diode-laser bar

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	Low thermal expansion coefficient cooler for diode-laser bar
其他题名	Low thermal expansion coefficient cooler for diode-laser bar
	CARTER, SERRENA M.; MARTINSEN, ROBERT
	2006-03-02
专利权人	COHERENT, INC.
公开日期	2006-03-02
授权国家	美国
专利类型	发明申请
摘要	A heat sink for cooling a diode-laser bar on a gallium arsenide (GaAs) substrate includes a water-cooled copper body. A layer of a metal having a coefficient of expansion (CTE) about equal to or greater than that of gallium arsenide but less than that of copper is bonded to each of two opposite surfaces of the body. A layer of copper is bonded each of the lower-CTE layers. The copper layers each have a thickness less than that of the lower-CTE layers and are under tensile strain. This provides that when a GaAs diode-laser bar is soldered to the heat sink the copper layers do not expand any more than the lower-CTE layers differential expansion between the copper and the lower CTE material merely reduces the tensile strain in the layers.
其他摘要	用于冷却砷化镓（GaAs）基板上的二极管激光器条的散热器包括水冷铜体。膨胀系数（CTE）约等于或大于砷化镓但小于铜的膨胀系数的金属层粘合到主体的两个相对表面中的每一个上。每层下CTE层粘合一层铜。铜层的厚度均小于下CTE层的厚度，并且处于拉伸应变下。这提供了当GaAs二极管激光器条焊接到散热器时，铜层不会比下CTE层膨胀，铜和下CTE材料之间的差异膨胀仅仅减小了层中的拉伸应变。
主权项	Apparatus for cooling a diode-laser formed on a semiconductor substrate, comprising: a body of a first metal, said metal body having channels therein for circulating a cooling fluid therethrough, and said body having first and second opposite surfaces; a first layer of a second metal bonded to said first surface of said body, said second metal having a coefficient of thermal expansion (CTE) equal to or greater than that of said substrate but less than that of said first metal; and a first layer of a third metal having a thickness less than that of first layer of said second metal and being bonded to said first layer of said second metal, said third metal having a CTE and a thermal conductivity greater than that of said second metal.
申请日期	2004-08-31
专利号	US20060045153A1
专利状态	失效
申请号	US10/930085
公开（公告）号	US20060045153A1
IPC 分类号	H01S3/04
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/53416
专题	半导体激光器专利数据库
作者单位	COHERENT, INC.
推荐引用方式 GB/T 7714	CARTER, SERRENA M.,MARTINSEN, ROBERT. Low thermal expansion coefficient cooler for diode-laser bar. US20060045153A1[P]. 2006-03-02.