Xi'an Institute of Optics and Precision Mechanics,CAS
Standoffs for passive alignment of semiconductor chip and coupling bench | |
其他题名 | Standoffs for passive alignment of semiconductor chip and coupling bench |
LIM, HWI; CHA CHER LIANG RANDALL; LAM, YEE; TEO KIAN HIN VICTOR; LIM HWI SIONG; LAM YEE LOY | |
2003-12-31 | |
专利权人 | DENSELIGHT SEMICONDUCTORS PTE LTD |
公开日期 | 2003-12-31 |
授权国家 | 世界知识产权组织 |
专利类型 | 发明申请 |
摘要 | Disclosed is a method for forming a first optical device (128) and a vertical stand-off (126) on adjacent regions of a substrate. The method comprises the steps of: depositing subsequent layers of optical materials on the substrate and defining features of the optical device by masking and etching regions of at least one layer; defining the transverse extent of the stand-off by protectively masking a separate region of the or each layer that is etched; modifying the relative thickness of an upper section of the stand-off and the first optical device so that a second optical device (200) subsequently supported by the stand-off is in close optical alignment with the first optical device; and etching a trench through one or more layers of material between the vertical stand-off and the first optical device. Also disclosed is an optical assembly comprising a first optical device and at least one vertical stand-off formed on adjacent regions of a substrate. |
其他摘要 | 公开了一种在基板的相邻区域上形成第一光学器件(128)和垂直支座(126)的方法。该方法包括以下步骤:在基板上沉积后续的光学材料层,并通过掩蔽和蚀刻至少一层的区域来限定光学器件的特征;通过保护性地掩蔽蚀刻的每层的单独区域来限定支座的横向范围;改变支座的上部和第一光学装置的相对厚度,使得随后由支座支撑的第二光学装置(200)与第一光学装置紧密光学对准;在垂直支座和第一光学装置之间通过一层或多层材料蚀刻沟槽。还公开了一种光学组件,包括第一光学器件和形成在基板的相邻区域上的至少一个垂直支座。 |
主权项 | An optical assembly comprising a first optical device and at least one vertical stand-off formed on adjacent regions of a substrate, the or each vertical stand-off and a portion of the first optical device comprising a common planar multiple-layer structure, the relative thickness of an upper section of the first optical device and the or each vertical stand-off being such that a second separate optical device subsequently located on the or each stand- off is brought in close optical alignment with the first optical device. |
申请日期 | 2002-11-25 |
专利号 | WO2003048823A3 |
专利状态 | 未确认 |
申请号 | PCT/GB2002/005296 |
公开(公告)号 | WO2003048823A3 |
IPC 分类号 | G02B6/42 | G02B6/26 | G02B6/136 |
专利代理人 | GILL JENNINGS & EVERY, BROADGATE HOUSE, 7 ELDON STREET, LONDON EC2M 7LH, GB |
代理机构 | - |
文献类型 | 专利 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/52916 |
专题 | 半导体激光器专利数据库 |
作者单位 | DENSELIGHT SEMICONDUCTORS PTE LTD |
推荐引用方式 GB/T 7714 | LIM, HWI,CHA CHER LIANG RANDALL,LAM, YEE,et al. Standoffs for passive alignment of semiconductor chip and coupling bench. WO2003048823A3[P]. 2003-12-31. |
条目包含的文件 | ||||||
文件名称/大小 | 文献类型 | 版本类型 | 开放类型 | 使用许可 | ||
WO2003048823A3.PDF(193KB) | 专利 | 开放获取 | CC BY-NC-SA | 请求全文 |
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