Ceramic waferboard

OPT OpenIR > 半导体激光器专利数据库

	Ceramic waferboard
其他题名	Ceramic waferboard
	BOUDREAU, ROBERT A; TAN, SONGSHENG
	2003-05-19
专利权人	CORNING INCORPORATED
公开日期	2003-05-19
授权国家	澳大利亚
专利类型	发明申请
摘要	An optoelectronic module 1 includes a ceramic waferboard 2 having a groove 3 configured to passively position an optical fiber 4. The ceramic waferboard 2 includes an alignment feature configured to passively position an optical component. An optical device 8 is secured to the ceramic waferboard 2 in contact with the alignment feature to thereby position the optical device 8. An optical fiber 4 is positioned in the groove 3 with an end of the optical fiber 4 positioned adjacent the optical device 8 to thereby optically couple the optical fiber 4 to the optical device 8. The optoelectronic module 1 also includes an integrated circuit chip 11 secured to the ceramic waferboard 2, and a conductive material disposed on the ceramic waferboard 2 and electrically coupling the integrated circuit chip 11 to the optical device 8.
其他摘要	光电模块1包括陶瓷晶片板2，该陶瓷晶片板2具有被配置为被动地定位光纤4的凹槽3.陶瓷晶片板2包括被配置为被动地定位光学部件的对准特征。光学器件8固定到与对准特征接触的陶瓷晶片板2，从而定位光学器件8.光纤4位于凹槽3中，光纤4的一端位于光学器件8的附近从而将光纤4光学耦合到光学装置8.光电模块1还包括固定到陶瓷晶片板2的集成电路芯片11，以及设置在陶瓷晶片板2上并将集成电路芯片11电耦合到其上的导电材料。光学装置8。
主权项	" An optoelectronic module, comprising: a ceramic waferboard having a groove configured to passively position an optical fiber, said ceramic waferboard including an alignment feature configured to passively position an optical device; an optical device secured to said ceramic waferboard in contact with said alignment feature to thereby position said optical device; an optical fiber positioned in said groove with an end of said optical fiber positioned adjacent said optical device to thereby optically couple said optical fiber to said optical device; an integrated circuit chip secured to said ceramic waferboard; and a conductive material disposed on said ceramic waferboard and electrically coupling said integrated circuit chip to said optical device.
申请日期	2002-09-13
专利号	AU2002331855A1
专利状态	失效
申请号	AU2002331855
公开（公告）号	AU2002331855A1
IPC 分类号	G02B6/42 \| G02B6/36
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/52838
专题	半导体激光器专利数据库
作者单位	CORNING INCORPORATED
推荐引用方式 GB/T 7714	BOUDREAU, ROBERT A,TAN, SONGSHENG. Ceramic waferboard. AU2002331855A1[P]. 2003-05-19.