Xi'an Institute of Optics and Precision Mechanics,CAS
Ceramic waferboard | |
其他题名 | Ceramic waferboard |
BOUDREAU, ROBERT A; TAN, SONGSHENG | |
2003-05-19 | |
专利权人 | CORNING INCORPORATED |
公开日期 | 2003-05-19 |
授权国家 | 澳大利亚 |
专利类型 | 发明申请 |
摘要 | An optoelectronic module 1 includes a ceramic waferboard 2 having a groove 3 configured to passively position an optical fiber 4. The ceramic waferboard 2 includes an alignment feature configured to passively position an optical component. An optical device 8 is secured to the ceramic waferboard 2 in contact with the alignment feature to thereby position the optical device 8. An optical fiber 4 is positioned in the groove 3 with an end of the optical fiber 4 positioned adjacent the optical device 8 to thereby optically couple the optical fiber 4 to the optical device 8. The optoelectronic module 1 also includes an integrated circuit chip 11 secured to the ceramic waferboard 2, and a conductive material disposed on the ceramic waferboard 2 and electrically coupling the integrated circuit chip 11 to the optical device 8. |
其他摘要 | 光电模块1包括陶瓷晶片板2,该陶瓷晶片板2具有被配置为被动地定位光纤4的凹槽3.陶瓷晶片板2包括被配置为被动地定位光学部件的对准特征。光学器件8固定到与对准特征接触的陶瓷晶片板2,从而定位光学器件8.光纤4位于凹槽3中,光纤4的一端位于光学器件8的附近从而将光纤4光学耦合到光学装置8.光电模块1还包括固定到陶瓷晶片板2的集成电路芯片11,以及设置在陶瓷晶片板2上并将集成电路芯片11电耦合到其上的导电材料。光学装置8。 |
主权项 | " An optoelectronic module, comprising: a ceramic waferboard having a groove configured to passively position an optical fiber, said ceramic waferboard including an alignment feature configured to passively position an optical device; an optical device secured to said ceramic waferboard in contact with said alignment feature to thereby position said optical device; an optical fiber positioned in said groove with an end of said optical fiber positioned adjacent said optical device to thereby optically couple said optical fiber to said optical device; an integrated circuit chip secured to said ceramic waferboard; and a conductive material disposed on said ceramic waferboard and electrically coupling said integrated circuit chip to said optical device. |
申请日期 | 2002-09-13 |
专利号 | AU2002331855A1 |
专利状态 | 失效 |
申请号 | AU2002331855 |
公开(公告)号 | AU2002331855A1 |
IPC 分类号 | G02B6/42 | G02B6/36 |
专利代理人 | - |
代理机构 | - |
文献类型 | 专利 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/52837 |
专题 | 半导体激光器专利数据库 |
作者单位 | CORNING INCORPORATED |
推荐引用方式 GB/T 7714 | BOUDREAU, ROBERT A,TAN, SONGSHENG. Ceramic waferboard. AU2002331855A1[P]. 2003-05-19. |
条目包含的文件 | 条目无相关文件。 |
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