Xi'an Institute of Optics and Precision Mechanics,CAS
| Chip carrier apparatus and method | |
| 其他题名 | Chip carrier apparatus and method |
| KOZLOVSKY, WILLIAM J.; DAIBER, ANDREW J.; SAWYER, KEVIN A. | |
| 2003-12-18 | |
| 专利权人 | INTEL CORPORATION |
| 公开日期 | 2003-12-18 |
| 授权国家 | 美国 |
| 专利类型 | 发明申请 |
| 摘要 | A chip carrier having improver thermal properties, wherein the chip carrier may be formed having waist section, and a first transverse end portion joined to the waist section. A first surface of the carrier being configured to receive a chip thereon, and a second surface of the carrier configured to be coupled to a thermal control unit to provide cooling of the carrier and chip. The chip carrier may have a second transverse end portion joined to the waist portion in certain embodiments. |
| 其他摘要 | 一种具有改进的热性能的芯片载体，其中芯片载体可以形成为具有腰部，并且第一横向端部连接到腰部。载体的第一表面被配置为在其上接收芯片，并且载体的第二表面被配置为耦合到热控制单元以提供载体和芯片的冷却。在某些实施例中，芯片载体可具有连接到腰部的第二横向端部。 |
| 主权项 | A chip carrier apparatus, comprising: (a) a waist section; (b) a first, transverse end portion joined to said waist section; (c) a first surface configure to support said chip; and (d) a second surface configured to couple to a thermal control element. |
| 申请日期 | 2002-06-15 |
| 专利号 | US20030231669A1 |
| 专利状态 | 失效 |
| 申请号 | US10/173545 |
| 公开（公告）号 | US20030231669A1 |
| IPC 分类号 | H01S3/00 | H01S3/04 | H01S5/00 | H01S5/02 | H01S5/024 | H01S5/14 |
| 专利代理人 | - |
| 代理机构 | - |
| 文献类型 | 专利 |
| 条目标识符 | http://ir.opt.ac.cn/handle/181661/52755 |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | INTEL CORPORATION |
| 推荐引用方式 GB/T 7714 | KOZLOVSKY, WILLIAM J.,DAIBER, ANDREW J.,SAWYER, KEVIN A.. Chip carrier apparatus and method. US20030231669A1[P]. 2003-12-18. |
| 条目包含的文件 | 条目无相关文件。 | |||||
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