Laser diode module and mounting board

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	Laser diode module and mounting board
其他题名	Laser diode module and mounting board
	KATO, TOMOYA; SHIMIZU, TAKEO; IWASE, MASAYUKI; MURATA, HIDEAKI
	2002-04-25
专利权人	FURUKAWA ELECTRIC CO., LTD., THE
公开日期	2002-04-25
授权国家	美国
专利类型	发明申请
摘要	A laser diode module of the invention can release heat radiated from a laser diode efficiently, and is of small size and small power consumption. An outer surface (15) of a bottom plate (2) of a package (7) is formed to be a board mounting surface to be mounted on a printed board (20). A base (6) is fixed to the inner wall surface (9) side of the top plate (8) of the package (7) and a laser diode (3) is fixed to the base (6). In the invention, an exemplary configuration where heat radiated from the laser diode is released effectively is formed by disposing a heat radiating unit (4) on the outer surface (16) side of the top plate (8) of the package (7), for example. The heat radiating unit (4) is formed by disposing a plurality of heat radiating fins (5) arranged at intervals, for example. The configuration containing the heat radiating unit (4) releases heat radiated from the laser diode (3) through the base (6), the top plate (8) and the heat radiating unit (4).
其他摘要	本发明的激光二极管模块可以有效地释放从激光二极管辐射的热量，并且尺寸小且功耗小。封装（7）的底板（2）的外表面（15）形成为安装在印刷板（20）上的板安装表面。底座（6）固定到封装（7）的顶板（8）的内壁表面（9）侧，激光二极管（3）固定到底座（6）。在本发明中，通过在封装（7）的顶板（8）的外表面（16）侧设置散热单元（4），形成从激光二极管辐射的热量被有效释放的示例性配置，例如。散热单元（4）例如通过设置间隔设置的多个散热片（5）而形成。包含散热单元（4）的配置通过基座（6），顶板（8）和散热单元（4）释放从激光二极管（3）辐射的热量。
主权项	A laser diode module comprising: a package; and a laser diode housed inside the package, wherein an outer surface of a bottom plate of said package is formed to be a board mounting surface for board mounting, and said laser diode is fixed to a laser diode mounting part disposed on an inner wall surface side of a top plate of said package.
申请日期	2001-10-17
专利号	US20020048295A1
专利状态	失效
申请号	US09/977983
公开（公告）号	US20020048295A1
IPC 分类号	G02B6/42 \| H01S5/022 \| H01S5/024 \| H01S3/04
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/52560
专题	半导体激光器专利数据库
作者单位	FURUKAWA ELECTRIC CO., LTD., THE
推荐引用方式 GB/T 7714	KATO, TOMOYA,SHIMIZU, TAKEO,IWASE, MASAYUKI,et al. Laser diode module and mounting board. US20020048295A1[P]. 2002-04-25.