Semiconductor light emitting device having effective cooling structure and method of manufacturing the same

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	Semiconductor light emitting device having effective cooling structure and method of manufacturing the same
其他题名	Semiconductor light emitting device having effective cooling structure and method of manufacturing the same
	KIM, KI-SUNG; LEE, JUN-HO
	2006-08-10
专利权人	SAMSUNG ELECTRONICS CO., LTD.
公开日期	2006-08-10
授权国家	美国
专利类型	发明申请
摘要	A semiconductor light emitting device having a high heat emission efficiency and a method of manufacturing the same without reducing the light emission efficiency are provided. The semiconductor light emitting device includes a substrate, a thermal spreading layer formed on the substrate and patterned with predetermined gaps, a planarizing layer having a planarizing surface covering the thermal spreading layer, and a light emitting unit formed on the planarizing layer.
其他摘要	提供一种具有高发热效率的半导体发光器件及其制造方法，而不降低发光效率。该半导体发光器件包括基板，形成在基板上并以预定间隙图案化的热扩散层，具有覆盖热扩散层的平坦化表面的平坦化层，以及形成在平坦化层上的发光单元。
主权项	A semiconductor light emitting device comprising: a substrate; a thermal spreading layer formed on the substrate and patterned to have a plurality of patterns; a planarizing layer having a planarizing surface covering the thermal spreading layer; and a light emitting unit formed on the planarizing layer.
申请日期	2006-02-02
专利号	US20060176924A1
专利状态	失效
申请号	US11/345333
公开（公告）号	US20060176924A1
IPC 分类号	H01S5/00 \| H01L33/10 \| H01L33/14 \| H01L33/30
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/51521
专题	半导体激光器专利数据库
作者单位	SAMSUNG ELECTRONICS CO., LTD.
推荐引用方式 GB/T 7714	KIM, KI-SUNG,LEE, JUN-HO. Semiconductor light emitting device having effective cooling structure and method of manufacturing the same. US20060176924A1[P]. 2006-08-10.