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Method for fabricating a semiconductor laser device in which the P-type clad layer and the active layer are grown at different rates
其他题名Method for fabricating a semiconductor laser device in which the P-type clad layer and the active layer are grown at different rates
YOKOTSUKA, TATSUO; TAKAMORI, AKIRA; NAKAJIMA, MASATO; SUZUKI, TOMOKO
1993-03-02
专利权人MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
公开日期1993-03-02
授权国家美国
专利类型授权发明
摘要A method for fabricating a semiconductor laser device wherein a first clad layer is formed on a GaAs monocrystal substrate of one conductivity type. The first clad layer is made of a compound semiconductor of one conductivity type represented by the formula, (Al.sub.x Ga.sub.1-x).sub.0.5 In.sub.0.5 P, wherein 0.4 .ltoreq.X.ltoreq. Then, an active layer of a compound semiconductor of the formula. (Al.sub.y Ga.sub.1-y).sub.0.5 In.sub.0.5 P, wherein 0.ltoreq.y.ltoreq.0.35 is formed on the first clad layer, on which a second clad layer of a compound semiconductor of the other conductivity type represented by the formula defined with respect to the first clad layer. At least one of the first and second clad layers is epitaxially grown at a rate of not larger than 0.5 .mu.m/hour sufficient to form a monolayer superlattice structure therein and the active layer is epitaxially grown at a rate of not less than 2.0 .mu.m/hour.
其他摘要一种制造半导体激光器件的方法,其中在一种导电类型的GaAs单晶衬底上形成第一覆层。第一包层由下式表示的一种导电类型的化合物半导体制成(Al.sub.x Ga1-x).0.5 In.sub.0.5 P,其中0.4≤X .ltoreq.1。然后,配方的化合物半导体的活性层。 (Al.sub.y Ga.sub.1-y).sub.0.5 In.sub.0.5 P,其中0.ltoreq.y≤0.35形成在第一包层上,其上第二包层由相对于第一包层定义的通式表示的另一种导电类型的化合物半导体。第一和第二包层中的至少一个以不大于0.5微米/小时的速率外延生长,足以在其中形成单层超晶格结构,并且有源层以不小于2.0的速率外延生长。微米/小时。
申请日期1991-06-05
专利号US5190891
专利状态失效
申请号US07/710483
公开(公告)号US5190891
IPC 分类号H01L33/00 | H01S5/323 | H01S5/00 | H01S5/30 | H01S3/19 | H01L21/203
专利代理人-
代理机构LOWE,PRICE,LEBLANC & BECKER
文献类型专利
条目标识符http://ir.opt.ac.cn/handle/181661/47367
专题半导体激光器专利数据库
作者单位MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
推荐引用方式
GB/T 7714
YOKOTSUKA, TATSUO,TAKAMORI, AKIRA,NAKAJIMA, MASATO,et al. Method for fabricating a semiconductor laser device in which the P-type clad layer and the active layer are grown at different rates. US5190891[P]. 1993-03-02.
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