Multilayered microelectronic device package with an integral window

OPT OpenIR > 半导体激光器专利数据库

	Multilayered microelectronic device package with an integral window
其他题名	Multilayered microelectronic device package with an integral window
	PETERSON, KENNETH A.; WATSON, ROBERT D.
	2003-03-25
专利权人	SANDIA CORPORATION
公开日期	2003-03-25
授权国家	美国
专利类型	授权发明
摘要	An apparatus for packaging of microelectronic devices is disclosed, wherein the package includes an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can comprise, for example, a cofired ceramic frame or body. The package has an internal stepped structure made of a plurality of plates, with apertures, which are patterned with metallized conductive circuit traces. The microelectronic device can be flip-chip bonded on the plate to these traces, and oriented so that the light-sensitive side is optically accessible through the window. A cover lid can be attached to the opposite side of the package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed. The package body can be formed by low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. Multiple chips can be located within a single package, according to some embodiments. The cover lid can include a window. The apparatus is particularly suited for packaging of MEMS devices, since the number of handling steps is greatly reduced, thereby reducing the potential for contamination. The integral window can further include a lens for optically transforming light passing through the window. The package can include an array of binary optic lenslets made integral with the window. The package can include an electrically-switched optical modulator, such as a lithium niobate window attached to the package, for providing a very fast electrically-operated shutter.
其他摘要	公开了一种用于封装微电子器件的装置，其中所述封装包括整体窗口。微电子器件可以是半导体芯片，CCD芯片，CMOS芯片，VCSEL芯片，激光二极管，MEMS器件或IMEMS器件。该包装可以包括例如共烧陶瓷框架或主体。封装具有由多个板制成的内部台阶结构，所述板具有孔，其被图案化为具有金属化导电电路迹线。微电子器件可以在板上倒装芯片接合到这些迹线，并且取向为使得光敏侧可通过窗口光学地接近。盖子盖可以附接到包装的相对侧。结果是紧凑的低剖面封装，具有可以气密密封的整体窗口。封装主体可以通过低温共烧陶瓷（LTCC）或高温共烧陶瓷（HTCC）多层工艺形成，其中窗口在LTCC或HTCC处理期间同时接合（例如共烧）到封装主体。根据一些实施例，多个芯片可以位于单个封装内。盖盖可以包括窗口。该装置特别适合于MEMS器件的封装，因为大大减少了处理步骤的数量，从而降低了污染的可能性。积分窗口还可以包括用于对穿过窗口的光进行光学转换的透镜。该封装可以包括与窗口成一体的二进制光学小透镜的阵列。该封装可以包括电开关光调制器，例如附接到封装的铌酸锂窗，用于提供非常快速的电操作快门。
申请日期	2002-02-01
专利号	US6538312
专利状态	授权
申请号	US10/061419
公开（公告）号	US6538312
IPC 分类号	B81B7/00 \| H01L23/053 \| H01L23/10 \| H01L23/02 \| H01L25/10 \| H05K1/18 \| H05K1/02
专利代理人	-
代理机构	WATSON, ROBERT D.
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/47206
专题	半导体激光器专利数据库
作者单位	SANDIA CORPORATION
推荐引用方式 GB/T 7714	PETERSON, KENNETH A.,WATSON, ROBERT D.. Multilayered microelectronic device package with an integral window. US6538312[P]. 2003-03-25.

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