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Semiconductor Laser
其他题名Semiconductor Laser
MATSUMOTO,KENJI C/O PATENT DIVISION, K.K. TOSHIBA; KURIHARA, HARUKI C/O PATENT DIVISION, K.K. TOSHIBA
1993-03-17
专利权人KABUSHIKI KAISHA TOSHIBA
公开日期1993-03-17
授权国家欧洲专利局
专利类型授权发明
摘要In a semiconductor laser, a substrate (15) is com­posed of a semiconductor basement (20) and a semiconduc­tor current-blocking layer (21) on the basement. A straight channel (90) is grooved into the current-­blocking-layer to reach the basement. The straight channel (90) has a constant width and is composed of a shallow window-region-channels (95A, 95B) in the vicinity of the cavity mirrors and a deep gain-region-­channel (96) in the middle of the laser cavity. A first cladding layer (25) is grown on the substrate (15). A semiconductor active layer (26) is grown on the first cladding layer (25). A second cladding layer (27) is grown on the active layer (26). A semiconductor ohmic contact layer (28) is grown on the second cladding layer (27). A pair of electrodes (29, 30) is deposited on each of the upper and lower surfaces of the semiconduc­tor laser device. A pair of cleaved facets (32A, 32B) is faced toward the direction perpendicular to the chan­nel.
其他摘要在半导体激光器中,衬底(15)由半导体基底(20)和基底上的半导体电流阻挡层(21)共同构成。将直通道(90)开槽到电流 - 阻挡层中以到达基底。直通道(90)具有恒定的宽度,并且由腔镜附近的浅窗区通道(95A,95B)和激光器中间的深增益区 - 通道(96)组成。腔。在衬底(15)上生长第一包层(25)。在第一包层(25)上生长半导体有源层(26)。在有源层(26)上生长第二包层(27)。在第二覆层(27)上生长半导体欧姆接触层(28)。一对电极(29,30)沉积在半导体激光器装置的上表面和下表面中的每一个上。一对切割面(32A,32B)面向垂直于通道的方向。
主权项A semiconductor laser comprising:    a substrate (15) which is composed of a semiconductor lower layer (20) of a first conductivity type and a semiconductor current-blocking-layer (21) of a second conductivity type on said lower layer;    a straight channel (90) formed in said current-blocking-layer to reach said lower layer;    a first cladding layer (25) of the first conductivity type grown on said substrate (15) by liquid-phase-epitaxy (LPE);    a semiconductor active layer (26) of the first or second conductivity type on said first cladding layer (25) grown by the LPE;    a second cladding layer (27) of the second conductivity type grown on said active layer (26);    a semiconductor ohmic contact layer (28) of the second conductivity type grown on said second cladding layer;    a pair of metal electrodes (29, 30), through which driving current flows in or out, deposited on each of the upper and lower surfaces of the semiconductor laser device; and    a pair of cleaved facets (32A, 32B) perpendicular to said channel and defining the laser cavity; characterized in that the straight channel (90) has a constant width throughout the laser cavity and is composed of shallow window-region-channels (95A, 95B) in the vicinity of the cavity mirrors and a deep gain-region-channel (96) in the middle of the laser cavity.
申请日期1988-05-17
专利号EP0291936B1
专利状态失效
申请号EP1988107892
公开(公告)号EP0291936B1
IPC 分类号H01S5/00 | H01S5/16 | H01S5/223 | H01S3/19
专利代理人-
代理机构HENKEL, FEILER, HÄNZEL & PARTNER
文献类型专利
条目标识符http://ir.opt.ac.cn/handle/181661/45694
专题半导体激光器专利数据库
作者单位KABUSHIKI KAISHA TOSHIBA
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MATSUMOTO,KENJI C/O PATENT DIVISION, K.K. TOSHIBA,KURIHARA, HARUKI C/O PATENT DIVISION, K.K. TOSHIBA. Semiconductor Laser. EP0291936B1[P]. 1993-03-17.
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