Xi'an Institute of Optics and Precision Mechanics,CAS
Method and system for heterogeneous substrate bonding of waveguide receivers | |
其他题名 | Method and system for heterogeneous substrate bonding of waveguide receivers |
KRASULICK, STEPHEN B.; DALLESASSE, JOHN | |
2013-12-17 | |
专利权人 | SKORPIOS TECHNOLOGIES, INC. |
公开日期 | 2013-12-17 |
授权国家 | 美国 |
专利类型 | 授权发明 |
摘要 | A composite integrated optical device includes a substrate including a silicon layer and a waveguide disposed in the silicon layer. The composite integrated optical device also includes an optical detector bonded to the silicon layer and a bonding region disposed between the silicon layer and the optical detector. The bonding region includes a metal-assisted bond at a first portion of the bonding region. The metal-assisted bond includes an interface layer positioned between the silicon layer and the optical detector. The bonding region also includes a direct semiconductor-semiconductor bond at a second portion of the bonding region. |
其他摘要 | 一种复合集成光学器件,包括:衬底,包括硅层;以及设置在硅层中的波导。复合集成光学器件还包括结合到硅层的光学检测器和设置在硅层和光学检测器之间的结合区域。结合区域包括在结合区域的第一部分处的金属辅助结合。金属辅助结合包括位于硅层和光学检测器之间的界面层。键合区域还包括在键合区域的第二部分处的直接半导体 - 半导体键合。 |
主权项 | A composite integrated optical device comprising: a complementary metal oxide semiconductor (CMOS) substrate comprising a silicon layer; a waveguide disposed in the silicon layer; an optical detector bonded to the silicon layer comprising; anda bonding region disposed between the silicon layer and the optical detector, wherein the bonding region comprises: a metal-assisted bond at a first portion of the bonding region, wherein the metal-assisted bond includes an interface layer positioned between the silicon layer and the optical detector; and a direct semiconductor-semiconductor bond at a second portion of the bonding region. |
申请日期 | 2011-03-03 |
专利号 | US8611388 |
专利状态 | 授权 |
申请号 | US13/040184 |
公开(公告)号 | US8611388 |
IPC 分类号 | H01S5/00 |
专利代理人 | - |
代理机构 | KILPATRICK TOWNSEND & STOCKTON LLP |
文献类型 | 专利 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/44706 |
专题 | 半导体激光器专利数据库 |
作者单位 | SKORPIOS TECHNOLOGIES, INC. |
推荐引用方式 GB/T 7714 | KRASULICK, STEPHEN B.,DALLESASSE, JOHN. Method and system for heterogeneous substrate bonding of waveguide receivers. US8611388[P]. 2013-12-17. |
条目包含的文件 | ||||||
文件名称/大小 | 文献类型 | 版本类型 | 开放类型 | 使用许可 | ||
US8611388.PDF(1014KB) | 专利 | 开放获取 | CC BY-NC-SA | 请求全文 |
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