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III nitride compound semiconductor element an electrode forming method
其他题名III nitride compound semiconductor element an electrode forming method
SHIBATA, NAOKI; UEMURA, TOSHIYA; ASAI, MAKOTO; KOIDE, YASUO; MURAKAMI, MASANORI
2004-10-19
专利权人TOYODA GOSEI CO., LTD.
公开日期2004-10-19
授权国家美国
专利类型授权发明
摘要An AlN buffer layer 2; a silicon (Si)-doped GaN high-carrier-concentration n layer 3; an Si-doped n-type Al0.07Ga0.93N n-cladding layer 4; an Si-doped n-type GaN n-guide layer 5; an active layer 6 having a multiple quantum well (MQW) structure, and including a Ga0.9In0.1N well layer 61 (thickness: about 2 nm) and a Ga0.97In0.03N barrier layer 62 (thickness: about 4 nm), the layers 61 and 62 being laminated alternately; an Mg-doped GaN p-guide layer 7; an Mg-doped Al0.07Ga0.93N p-cladding layer 8; and an Mg-doped GaN p-contact layer 9 are successively formed on a sapphire substrate. A p-electrode 10 is formed of a film of titanium nitride (TiN) or tantalum nitride (TaN) (thickness: 50 nm). The contact resistance of this electrode is reduced through heat treatment.
其他摘要AlN缓冲层2;硅(Si)掺杂的GaN高载流子浓度n +层3; Si掺杂的n型Al0.07Ga0.93N n包层4; Si掺杂的n型GaN n导向层5;有源层6具有多量子阱(MQW)结构,并包括Ga0.9In0.1N阱层61(厚度:约2nm)和Ga0.97In0.03N势垒层62(厚度:约4nm),层61和62交替层叠; Mg掺杂的GaN p导向层7; Mg掺杂的Al0.07Ga0.93N p包覆层8;在蓝宝石衬底上依次形成Mg掺杂的GaN p接触层9。 p电极10由氮化钛(TiN)或氮化钽(TaN)(厚度:50nm)的膜形成。通过热处理降低了该电极的接触电阻。
主权项A Group III nitride compound semiconductor device comprising: a p-type Group III nitride compound semiconductor, and an electrode made of tantalum titanium nitride (Ta.sub.y Ti.sub.1-y N.sub.z), which is formed on said p-type Group III nitride compound semiconductor.
申请日期2003-02-19
专利号US6806571
专利状态授权
申请号US10/239895
公开(公告)号US6806571
IPC 分类号H01L21/285 | H01L21/02 | H01L21/24 | H01L33/00 | H01S5/323 | H01S5/02 | H01S5/00 | C30B29/38 | H01L21/205 | H01L21/28 | H01L29/43 | H01L33/06 | H01L33/12 | H01L33/32 | H01L33/40 | H01S5/042 | H01S5/343
专利代理人-
代理机构MCGINN & GIBB,PLLC
文献类型专利
条目标识符http://ir.opt.ac.cn/handle/181661/44654
专题半导体激光器专利数据库
作者单位TOYODA GOSEI CO., LTD.
推荐引用方式
GB/T 7714
SHIBATA, NAOKI,UEMURA, TOSHIYA,ASAI, MAKOTO,et al. III nitride compound semiconductor element an electrode forming method. US6806571[P]. 2004-10-19.
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