Single level microelectronic device package with an integral window

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	Single level microelectronic device package with an integral window
其他题名	Single level microelectronic device package with an integral window
	PETERSON, KENNETH A.; WATSON, ROBERT D.
	2003-12-09
专利权人	SANDIA CORPORATION
公开日期	2003-12-09
授权国家	美国
专利类型	授权发明
摘要	A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semiconductor chip, CCD chip, CMOS chip, VCSEL chip, laser diode, MEMS device, or IMEMS device. The package can be formed of a multilayered LTCC or HTCC cofired ceramic material, with the integral window being simultaneously joined to the package during cofiring. The microelectronic device can be flip-chip interconnected so that the light-sensitive side is optically accessible through the window. A glob-top encapsulant or protective cover can be used to protect the microelectronic device and electrical interconnections. The result is a compact, low profile package having an integral window that is hermetically sealed to the package prior to mounting and interconnecting the microelectronic device.
其他摘要	一种带有整体窗口的封装，用于容纳微电子器件。整体窗口直接粘合到包装上，而没有在窗口和包装之间设置单独的粘合材料层。该器件可以是半导体芯片，CCD芯片，CMOS芯片，VCSEL芯片，激光二极管，MEMS器件或IMEMS器件。该封装可以由多层LTCC或HTCC共烧陶瓷材料形成，在整理期间整体窗口同时连接到封装。微电子器件可以倒装芯片互连，使得光敏侧可通过窗口光学地接近。球形顶部密封剂或保护盖可用于保护微电子器件和电互连。结果是紧凑的薄型封装，其具有在安装和互连微电子器件之前密封到封装的整体窗口。
授权日期	2003-12-09
申请日期	2002-02-25
专利号	US6661084
专利状态	授权
申请号	US10/083454
公开（公告）号	US6661084
IPC 分类号	B81B7/00 \| H01L23/053 \| H01L23/10 \| H01L23/02 \| H01L25/10 \| H05K1/18 \| H05K1/02
专利代理人	-
代理机构	WATSON, ROBERT D.
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/40001
专题	半导体激光器专利数据库
作者单位	SANDIA CORPORATION
推荐引用方式 GB/T 7714	PETERSON, KENNETH A.,WATSON, ROBERT D.. Single level microelectronic device package with an integral window. US6661084[P]. 2003-12-09.

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